Dataifeng focused on the BGA chip welding technology,BGA balls technical solution equipment tools,bga welding machine.
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Some of company's current situation and latest trade news

  • Dataifeng birthday party, Happy birthday to to them!! Dataifeng birthday party, Happy birthday to to them!!
    Dataifeng birthday party, Happy birthday to to them!!
    2022/07/04
  • Dataifeng of strength Dataifeng of strength
    Shenzhen Dataifeng Technology Co., LTD., founded in March 2009, focuses on solving the SMT process of electronic chip welding technology, set research and development, production, sales and service in one of the production of r & D company. By courtesy of the general customers the support and the joint efforts of all staff, the chip disassembling welding, balls, and repair technology, independent research and development has a number of high-tech intellectual property patent core technology products, taifeng through innovation, full pursuit of the perfect automation electronic chip repair tools and equipment, quality process continuous optimization, With persistent professional technology and high-quality after-sales technical services, to create more customer recognition and support.
    2021/07/13
  • Why Dataifeng? Why Dataifeng?
    Why choose Datafeng: Since 2009, datai Fung has been focusing on customers' BGA welding,BGA repair and BGA ball planting requirements as before, with consistent quality and service. According to different product applications, datai Fung will provide customers with better solutions immediately. We not only provide technical services, but also save labor costs and production costs for customers. Da Tai Fung has been updating its own products and services for many years, and we are making progress every day!
    2021/07/13
  • BGA repair table the most complete use of methods and skills BGA repair table the most complete use of methods and skills
    The use of BGA repair table can be roughly divided into three steps: diswelding, mounting, welding. All changes remain the same.
    2022/12/03
  • BGA repair platform is divided into optical and non-optical alignment BGA repair platform is divided into optical and non-optical alignment
    Optical alignment -- Through the optical module using the crack prism imaging, LED lighting, adjust the light field distribution, so that the small chip imaging display and display. To achieve optical counterpoint repair
    2022/12/03
  • What is the superior function of BGA repair table? What is the superior function of BGA repair table?
    Independent three-temperature zone temperature control system:The upper and lower temperature zone is hot air heating, IR preheating zone is infrared heating, the temperature is accurately controlled at ±1℃, the upper and lower temperature zone can be heated from the top of the component and the bottom of the PCB at the same time, and can be set at the same time 8 sections of temperature control, can make the PCB board heating uniform, large IR bottom preheating, make the whole PCB temperature uniform, prevent deformation, ensure the welding effect. The heating plate can control the heating independently.
    2022/12/03
  • What are the key factors for the high success rate of BGA repair? What are the key factors for the high success rate of BGA repair?
    Today, Xiaobian will bring you about the BGA repair platform high repair success rate of the key factors are introduced, I hope to benefit you oh ~1.BGA repair platform is simply a machine for dismantling (BGA package) chips. Can improve the success rate of chip repair, and don't worry about damage PCB board and peripheral chips.
    2022/12/03
  • BGA repair table repair scope introduction BGA repair table repair scope introduction
    The full name of BGA is Ball Grid Array (welding ball array package), which is made at the bottom of the packaging body substrate array welding ball as the I/O end of the circuit and the printed circuit board (PCB) interconnect. The device encapsulated by this technology is a surface mount device
    2022/12/03
  • How to choose a good BGA repair table? How to choose a good BGA repair table?
    With the wide application of BGA chip, including computer motherboard, mobile phone, webcam, TV motherboard, communication products and other fields, the demand for BGA repair table is also increasing. Some friends often ask me how to choose the right BGA repair table. BGA repair platform It is easy to use and practical, choose a good BGA repair platform should be mainly from the following aspects:
    2022/12/02
  • Introduction to BGA repair table welding and parameter control Settings Introduction to BGA repair table welding and parameter control Settings
    Today, Xiaobian will introduce the BGA repair platform welding and parameter control Settings, 1, power supply: AC220V± 10% 50/60Hz; 2. Total power: 4000W; 3. Heater power: upper hot air heater 1200W; Lower hot air heater 1200W; Bottom infrared heater 1600W; 4. Electrical material selection: PLC programmable controller + large-screen true color touch screen + high-precision intelligent temperature control module; 5, temperature control: K type high thermocouple closed-loop control, independent temperature control, accuracy up to ±2 degrees; 6. Positioning mode: V-shaped card slot, PCB bracket can be adjusted and configured with universal fixture. 7, PCB size: Max 210*260mm, Min 20 * 20 mm; 8. Dimensions: L470×W330×H430mm(without display support); 9. Machine weight: 36kg; 10. Appearance color: black.
    2022/12/02
  • BGA repair table is used in mobile phone chip welding operation BGA repair table is used in mobile phone chip welding operation
    Today, Xiaobian will introduce the application of BGA repair table in mobile phone chip welding operation: 1, disassembly; 1) After turning on the main power switch, set all programs according to the above method and turn on the power supply. 2) Install the PCB board to be removed and the appropriate air nozzle, so that the upper heater center is directly facing the BGA center on the PCB board, manually control the rocker, make the upper heater downward, stop when the lower surface of the heater air nozzle is 3 ~ 5MM away from the upper surface of the BGA, click the start button, then the system starts heating. And according to the set of data you set, achieve preheating, heating, etc., until the program is completed, the rocker controls downward. When the suction touches the BGA chip, there will be a vacuum inside the suction rod to absorb the BGA, at this time, the rocker upward, the BGA will be sucked up, click the stop button, the disassembly process is finished.
    2022/12/02
  • This article gives you a comprehensive understanding of the BGA repair table This article gives you a comprehensive understanding of the BGA repair table
    BGA repair platform is a small but large (small size but can repair 750mmX620mm large board) with optical alignment system, using infrared gas (including nitrogen or compressed air) mixed heating, all movements driven by motor, software control of diswelding integrated repair workstation. Used for diswelding all kinds of package chips. Is applicable to any BGA devices, special components POP and difficult repair, CCGA, the QFN, BGA, CSP, the LGA, Micro SMD, MLF (Micro Lead Frames).
    2022/12/02

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