In the field of electronics industry, we often see all kinds of packaging, especially electronic manufacturing engineering, according to the level of electronic packaging is divided into four stages, respectively corresponding to the chip level, component level, circuit board level and system level packaging.
With the development of electronic technology, intelligent books, Internet of Things, autonomous vehicles, 5G communication, AR, VR With the continuous emergence of artificial intelligence, electronic information technology and semiconductor technology have entered a boom era.
At present, in the packaging testing of electronic information technology and semiconductor technology, the commonly used testing quality technology is "x-ray testing equipment", which will be customized according to the SMT requirements of the equipment.
X-RAY detection devices use cathode electrons and metals to target the sudden deceleration during the shock process resulting in energy conversion, and the lost kinetic energy will be released through the form of X-RAY. It is important to note here that X-rays, because of their density, can penetrate different densities of matter at different energies.
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