With the development of electronic products to multi-function, high density, miniaturization and three-dimensional direction, more and more micro devices are used, which means that each unit area equipment I/O more and more, and there will be more and more heating elements, heat dissipation requirements will become more and more important. At the same time, thermal stress and warping due to the different coefficient of thermal expansion of various materials will increase the risk of assembly failure and the possibility of premature failure of electronic products will also increase. In this situation, the reliability of BGA welding is particularly important.
In order to ensure the quality of products, electronic component packaging and BGA welding testing usually adopt a variety of detection methods for failure analysis. X-RAY nondestructive testing (NDT) is the only testing method that visually displays the internal defects of products through images, and then the software can automatically judge according to preset defect parameters to achieve high efficiency and intelligence.
The pillow defect is a difficult defect to detect and is a common defect in spherical pin grid array package (BGA) and chip level package (CSP) components. Pillow defects are the BGA and CSP parts of the ball and solder do not fully fuse, do not form a good electrical connection and mechanical solder spot, solder paste and BGA welding ball reflux but do not merge, as if the head is placed on a soft pillow.
Pillow defects are also one of the virtual welding, with strong concealment, because of insufficient welding strength, in the subsequent testing, assembly, transportation or use of the process of failure, which will seriously affect the quality of the product and the company's reputation. Therefore, pillow defects can be very harmful
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