BGA repair table repair scope introduction

December 03, 2022

The full name of BGA is Ball Grid Array (welding ball array package), which is made at the bottom of the packaging body substrate array welding ball as the I/O end of the circuit and the printed circuit board (PCB) interconnect. The device encapsulated by this technology is a surface mount device

Repair table is a kind of instrument for BGA chip pin repair, BGA pin is very small, want to see the physical dismantling of mobile phone motherboard chip

BGA repair table repair scope introduction

BGA is a chip packaging technology. The equipment for repairing BGA chip is called BGA repair table. Its repair range includes various packaging chips. BGA is to improve the performance of digital products and reduce the volume of products through the ball-grid array structure. All the digital products through this packaging technology have a common feature, that is, small size, strong performance, low cost, powerful functions. BGA repair table is used to repair the BGA chip machine. When a chip is detected to have a problem and must be repaired, then it needs to use the BGA repair table to repair, this is the role of the BGA repair table.

The first is the high success rate of repair. At present, the new generation of optical counterpoint BGA repair table introduced by BGA repair table can achieve 100% success rate when repairing BGA. Now the mainstream heating methods are full infrared, full hot air and two hot air one infrared, domestic BGA repair table heating method is generally upper and lower hot air, the bottom infrared preheating three temperature zone (two temperature zone BGA repair table only upper hot air with the bottom preheating, relative to the three temperature zone is lagging behind). This heating method is mainly used. The upper and lower heating heads are heated by heating wire and the hot air is exported by air flow. The bottom preheating can be divided into dark red external heating pipe, infrared heating plate or infrared light wave heating plate to heat the whole PCB board.

The second is simple operation. Use BGA repair platform to repair BGA, you can change the second BGA repair master. Simple upper and lower heating: heating through hot air, and use the air nozzle to control the hot air. The heat is concentrated on the BGA to prevent damage to the surrounding components. And through the convection of hot air up and down, it can effectively reduce the probability of deformation of the board. In fact, this part is the equivalent of a heat gun with an air nozzle, but the temperature of the BGA repair table can be adjusted according to the set temperature curve. Bottom preheating board: It plays a preheating role to remove the moisture inside PCB and BGA, and can effectively reduce the temperature difference between the heating center and the surrounding point, and reduce the probability of deformation of the board.

Then is the clamping fixture of PCB board and the lower PCB support frame, this part of the PCB board plays a fixed and supporting role, to prevent the deformation of the board plays an important role. Optical alignment through the screen, as well as automatic welding and automatic welding and other functions. Under normal conditions, it is difficult to weld BGA by heating alone. The most important thing is to heat and weld according to the temperature curve. This is the key difference between using BGA repair table and heat gun to dismantle and weld BGA. At present, most BGA repair tables can be repaired directly by setting the temperature. Although the heat gun can control the temperature, it cannot directly observe the real-time temperature. Sometimes, it is easy to directly burn the BGA if it is overheated.

BGA repair table is not easy to damage the BGA chip and PCB board. As we all know, when repairing BGA, high temperature heating is needed. At this time, the temperature control precision is very high. A slight error may lead to the scrap of BGA chip and PCB board. The temperature control precision of the BGA repair table can be accurate to within 2 degrees, so as to ensure the integrity of the BGA chip in the process of repair, which is also one of the roles that the heat gun can not compare. The final core of the success of our BGA repair is the temperature and deformation of the board surrounding the repair, which are the key technical issues. The machine avoids human influence factors to a large extent, so that the success rate of repair can be improved and maintained stable. BGA repair table chip fixing device

BGA repair table can also prevent solder from flowing to other pads, to achieve a symmetrical size of the ball. After washing the BGA, it can be aligned and mounted on the PCB, and then flow again. At this point, the component is repaired. It is necessary to point out that the acceptance of manual washing pad is not timely and thorough removal of impurities. Therefore, it is recommended that you choose automatic BGA repair table when you buy BGA repair table, which can save you most of the time, personnel costs and money. Although the price is relatively high in the purchase of automatic BGA repair table, the repair efficiency and performance are incomparable to manual BGA repair table, so please do a good job of evaluation and comparison before you buy.

If you want to know more about the role of BGA repair table, or need to buy a BGA repair table with high repair yield, then you can consider our Shenzhen Datafeng products, will make you satisfied ~


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