Optical alignment -- Through the optical module using the crack prism imaging, LED lighting, adjust the light field distribution, so that the small chip imaging display and display. To achieve optical counterpoint repair
Non-optical alignment -- The BGA is aligned with the silk screen lines and points of the PCB board by the naked eye to achieve alignment repair.
Intelligent operation equipment for visual alignment, welding and disassembly of BGA originals of different sizes can effectively improve the repair rate productivity and greatly reduce the cost.
The I/O terminals of BGA Package (Ball Grid Array Package) are distributed under the package with circular or cylindrical solder joints in the form of array. The advantage of BGA technology is that although the number of I/O pins increases, the spacing of pins increases instead of decreasing, thus improving the assembly yield. Although its power consumption increases, BGA can be welded by the method of controlled collapse chip, thus improving its electric heating performance. The thickness and weight are reduced compared to the previous packaging technology; The parasitic parameter is reduced, the signal transmission delay is small, and the use frequency is greatly increased. Assembly can be coplanar welding, high reliability.
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