Simple operation introduction of BGA repair table

December 05, 2022

Today, Xiaobian to introduce the BGA repair platform, hope to help you ~BGA is a chip packaging technology. BGA chip repair equipment called BGA repair table, the repair scope includes all kinds of packaging chips. BGA improves the performance of digital products and reduces the volume of products through ball-grid array structure. All the digital products through the packaging technology have the common characteristics of small size, strong performance, low cost and strong function. BGA repair table is a machine used to repair BGA chips. When the chip problem is found and must be repaired, the BGA repair table is needed for repair. That's what the BGA repair table does.

Let's take a look at the advantages of BGA repair table, the first is the high repair success rate. At present, the success rate of the new generation of optical counterpoint BGA repair table launched by our company can reach 100% when repairing BGA. Now the mainstream heating methods are full infrared, full hot air and two hot air one infrared, domestic BGA repair table heating method is generally upper and lower hot air, the bottom infrared preheating three temperature zone (two temperature zone BGA repair table only upper hot air with the bottom preheating, relative to the three temperature zone is lagging behind). Our company mainly uses this heating method. The upper and lower heating heads are heated by heating wire and the hot air is exported by air flow. The bottom preheating can be divided into dark red external heating pipe, infrared heating plate or infrared light wave heating plate to heat the whole PCB board.

The second is simple operation. Use BGA repair platform to repair BGA, you can change the second BGA repair master. Simple upper and lower heating: heating through hot air, and use the air nozzle to control the hot air. The heat is concentrated on the BGA to prevent damage to the surrounding components. And through the convection of hot air up and down, it can effectively reduce the probability of deformation of the board. In fact, this part is the equivalent of a heat gun with an air nozzle, but the temperature of the BGA repair table can be adjusted according to the set temperature curve. Bottom preheating board: It plays a preheating role to remove the moisture inside PCB and BGA, and can effectively reduce the temperature difference between the heating center and the surrounding point, and reduce the probability of deformation of the board.

BGA repair table operation panel

Then is the clamping fixture of PCB board and the lower PCB support frame, this part of the PCB board plays a fixed and supporting role, to prevent the deformation of the board plays an important role. Optical alignment through the screen, as well as automatic welding and automatic welding and other functions. Under normal conditions, it is difficult to weld BGA by heating alone. The most important thing is to heat and weld according to the temperature curve. This is the key difference between using BGA repair table and heat gun to dismantle and weld BGA. At present, most BGA repair tables can be repaired directly by setting the temperature. Although the heat gun can control the temperature, it cannot directly observe the real-time temperature. Sometimes, it is easy to directly burn the BGA if it is overheated.

Fourth, the use of BGA repair table is not easy to damage BGA chip and PCB board. As we all know, when repairing BGA, high temperature heating is needed. At this time, the temperature control precision is very high. A slight error may lead to the scrap of BGA chip and PCB board. The temperature control precision of the BGA repair table can be accurate to within 2 degrees, so as to ensure the integrity of the BGA chip in the process of repair, which is also one of the roles that the heat gun can not compare. The final core of the success of our BGA repair is the temperature and deformation of the board surrounding the repair, which are the key technical issues. The machine avoids human influence factors to a large extent, so that the success rate of repair can be improved and maintained stable.

BGA repair table chip fixing device

Fifth, the BGA repair table can not make the solder flow to other pads, to achieve a symmetrical size of the welding ball. After washing the bga, it can be aligned and mounted on the pcb, and then flow again. At this point, the component is repaired. It is necessary to point out that the acceptance of manual washing pad is not timely and thorough removal of impurities. Therefore, it is recommended that you choose automatic BGA repair table when you buy BGA repair table, which can save you most of the time, personnel costs and money. Although the price is relatively high in the purchase of automatic BGA repair table, the repair efficiency and performance are incomparable to manual BGA repair table, so please do a good job of evaluation and comparison before you buy.

Above is a small series for you to introduce the role of BGA repair table all content. BGA repair table is mainly used for repairing BGA chips. If you want to know more about the function of BGA repair table or need to buy a BGA repair table with high repair yield, you can consider our products. I believe that our products will make you satisfied.


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