Today, Xiaobian to tell you about the use of BGA repair table description, I hope to benefit you ~
Step 1: Select the corresponding air nozzle and suction nozzle. To know whether the repaired chip contains lead, set the corresponding temperature curve, the melting point of the leaded tin ball is 183℃, and the melting point of the lead-free tin ball is about 217℃. The PCB motherboard to be repaired is fixed on the BGA repair table, the laser red dot is positioned at the center of the BGA chip, and then the mounting head is shaken down to determine the mounting height.
Step two: Set the diswelding temperature and store it so that it can be called directly when repairing in the future. In general, the temperature of dissoldering and welding can be set to the same set. Then switch to the disassembly mode on the touch screen interface, click the repair key, and the heating head will automatically come down to heat the BGA chip.
Step 3: After the temperature curve is completed, the machine will give an alarm and give a drip sound. At the same time, the suction nozzle will automatically suck up the BGA chip, and then the mounting head will suck up the BGA chip and automatically place it in the material box. Here, the welding work of the damaged BGA chip will be completed.
Step four: After the tin removal on the pad is completed, use the new BGA chip, or the BGA chip after the planting ball. Fixed PCB motherboard. Place the BGA to be welded approximately in the position of the pad. Switch to mount mode, click the start button, the mount head will move down, and the suction nozzle will automatically suck up the BGA chip to the initial position.
Step 5: BGA tin ball welding, set the welding temperature of the heating table (about 230℃ with lead, about 250℃ without lead), open the optical alignment lens, adjust the X axis and Y axis to adjust the front and back of the PCB board, R Angle to adjust the BGA Angle, adjust the tin ball and solder joint completely coincide, click the "alignment finish button" on the touch screen. The mounting head will automatically drop, put the BGA on the pad, wait for the nozzle will automatically rise 2~3mm for heating. After the temperature curve is completed, the heating head will automatically rise to the initial position and the welding is completed.
Step 6: Under normal circumstances, the repair of BGA chip can be completed after completing the above five steps, but sometimes it is inevitable to re-weld. In this case, the PCB needs to be placed on the workbench and a proper layer of welding paste is applied to the welding pad with a brush, and the BGA pad and the PCB pad are basically identical. The direction label on the BGA surface should correspond to the direction label on the silkscreen frame of the PCB board to prevent the BGA from being placed in the opposite direction. When the tin ball is melted and welded, the tension between the solder joints will produce a certain self-centering effect. Finally, the temperature curve of diswelding is applied to click welding. After the end of heating, the automatic cooling can be removed and the repair is completed.
So the above six steps are about the use of BGA repair table description, have you learned?
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