How to use BGA repair table to disweld?

Description of the method of diswelding with BGA repair table:

1. Preparation for repair: Determine the air nozzle suction nozzle for the BGA chip to be repaired.

2. Set the diswelding temperature and store it so that it can be called directly when repairing in the future.

3. Switch modes on the touch screen interface, click the repair key, and the heating head will automatically come down to heat the BGA chip.

4. After the temperature curve of the repair platform is finished, the suction nozzle will automatically suck up the BGA chip, and then the mounting head will suck up the BGA and rise to the initial position. The operator can connect the material box with BGA chip.

The diswelding is complete.

This is the method of diswelding using BGA repair table. Mounting welding, welding use method is not difficult. Generally, manufacturers will be equipped with instructions, and it is good to follow the instructions. Like our BGA repair platform, we usually have technical personnel to guide and teach.

Bottom line: Practice and think a lot, you will find that the BGA repair table is so simple to use.

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