BGA repair table SMT BGA chip repair steps are what?

Today, Xiaobian will focus on explaining SMT BGA chip repair steps. 1. Board baking preparation and related requirements before maintenance.

① According to the different exposure time, the boards are given different baking requirements. The exposure time of the boards: the processing month time on the bar code of the boards shall be the standard, and so on.

② Baking time, according to the following provisions for baking:

Exposure time ≤2 months more than 2 months

Bake time 10 hours 20 hours

The baking temperature is 105±5℃

③ Before drying the board, the repairman should remove the temperature-sensitive components, such as optical fiber and plastic, and bake them; Otherwise, the device will be damaged by heat. (4) For all boards, the BGA repair work must be completed within 10 hours after the board is removed after baking.

⑤ PCBA that cannot complete the BGA repair work within 10 hours should be placed in a drying oven for storage, otherwise it will easily lead to backwetting, and the backwetting PCBA will easily cause the PCBA bulge during welding.

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