The full name of BGA is BallGridArray (ball array package), which is made in the bottom edge of the package substrate array ball as the I/O end of the circuit and the printed circuit board (PCB) interconnect. BGA is a kind of chip packaging technology. The machine equipment for repairing BGA chip is called BGA repair table. The scope of the repair includes all kinds of package chips. BGA is based on the ball grid array structure to enhance the characteristics of digital equipment, reduce the size of goods. All the digital devices based on this packaging technology have the same characteristics, that is, small size, strong features, low cost, powerful. BGA repair table is used to repair the BGA chip equipment.
First of all, the repair pass rate is high. Datafeng optical counterpoint BGA repair table can achieve 100% success rate in the process of repairing BGA. At present, popular methods are full infrared, whole hot air and two hot air one infrared. The way of BGA returning to repair station in our country is up and down hot air and preheat three temperature areas at the bottom infrared. Mainly is to use this way, the upper and lower head according to the heating wire and according to the air flow of the hot air is exported, the bottom preheating can be divided into dark red external heat pipe, infrared heating plate or infrared light wave heating plate to do the whole heating of PCB board.
On the other hand, it is easy to operate. Use BGA repair table repair BGA, you can change the second BGA repair master. Then is the clamping fixture of PCB board and the lower PCB support frame, this part of the PCB board plays a fixed and supporting role, to prevent the deformation of the board plays an important role. Perform optical alignment accurately according to the screen, as well as automatic welding and automatic welding and other functions. Under normal circumstances, it is difficult to weld BGA well only if done well. The most important thing is to weld well according to the temperature curve. This is also the crucial difference between using BGA repair table and hot air welding gun to dismantle and weld BGA. At present, most of the BGA repair table can be repaired directly according to the set temperature. Although the hot air welding gun can control the temperature, it can not directly observe the real-time temperature, and sometimes it is easy to directly burn the BGA.
It is difficult to destroy BGA chip and PCB board by using BGA repair table. We all know that in the process of repairing BGA, high temperature heating is required. At this time, the temperature control precision is particularly high. A slight deviation may cause the complete scrap of BGA chip and PCB board. The temperature control precision of the BGA repair table can be accurate to 2 degrees, so as to ensure the integrity of the chip in the repair of the BGA chip, which is also the role of the hot air welding gun can not be compared. The ultimate core of our success in repairing BGA is the temperature and deformation of the board around the repair, which is a crucial technical issue. The equipment avoids human influence factors to a great extent, so that the success rate of repair can be improved and maintained stable.
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