Comparison of repair ability of BGA repair station

January 04, 2023

BGA repair table according to different benchmarks can be divided into a variety of types, the more common is automatic BGA repair table and manual BGA repair table, which type of BGA repair table repair ability? Let's compare them together. What are the differences between automatic BGA repair table and manual BGA repair table?

Automatic BGA repair table can repair BGA chip repair quantity, strong sustainability, high credibility. In particular, it can save a lot of labor costs and high repair yield. In the repair process, it can quickly complete automatic dismantling and welding without manual control of employees, which greatly reduces the difference caused by human factors in operation.

Again, automatic BGA repair table using automatic generation repair temperature curve machine equipment automatic development interface can use the mouse to move seven points on the interface, draw an ideal temperature curve, the machine equipment will automatically set the temperature curve parameters, quickly form a reliable repair curve. And the fully automatic BGA repair table features a flexible and easy-to-use PCBA substrate placement platform that can repair PCBA substrates of different sizes and shapes. More common automatic BGA repair table are: Da Tai Feng DT-F630, Da Tai Feng DT-F750, BGA chip repair ability is very strong.

Manual BGA repair table repair yield and repair efficiency are very low, only suitable for BGA chip repair less companies or individual repairers. General manual BGA repair table is only able to repair simple BGA chips. It is difficult to meet the repair requirements with higher precision, because manual BGA repair table does not have the function of alignment system and temperature automatic curve generation.

The common manual BGA repair table is: Datafeng DT-F350, can be combined with equipment according to customer needs, repair capacity is low.

All in all, the automatic BGA repair table has more powerful repair ability.


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