Future development trend of BGA manual welding

January 29, 2023

Manual welding of BGA refers to the process of removing and welding BGA, QFN, QFP and other electronic components with hot air gun, electric soldering iron and other tools. This is a traditional way of repair. Before 2004, when BGA repairing platform is not popularized in our country, hot air guns and electric irons are widely used in SMT factories, various computer repair shops and after-sales repair point. Because before that, BGA repair platform almost all rely on imports, the price is very expensive, generally only foreign enterprises will consider using. In the extensive Pearl River Delta, Yangtze River Delta and other areas, domestic enterprises have just developed, management and production systems need to be perfected, a variety of production techniques need to be improved and introduced, and the production equipment of various departments need to be updated. The majority of domestic enterprises in this case, difficult to rely on cheap labor to support the production of enterprises. Expensive assistive devices are almost never considered.

After 2004, the domestic batch of BGA repair table research and development manufacturers really began, Datafeng Technology company is one of them. Since then, domestic enterprises have slowly accepted the BGA repair equipment, gradually introduced it into the production workshop, and the repair process has been improved. In this process, the BGA repair platform has greatly improved the success rate of repair welding, and even replaced the hot air gun and electric soldering iron, becoming the mainstream repair equipment. BGA repair equipment can complete ordinary welding tools can not complete the work, such as optical alignment, such as BGA repair table can be more extent to avoid the repair of the motherboard deformation, but also to ensure that the BGA is not damaged.

Compared with manual welding, the advantages of BGA repair table are obvious. Until the development of SMT equipment to today, ball planting machine, tin removing machine and other automatic auxiliary equipment have not been widely used, heat gun and electric soldering iron combined with other tools and auxiliary materials, also play a great role in the field of repair. However, in another 20 years, due to the rising labor costs in the mainland and the international requirements of Industry 4.0, electronic processing enterprises will urgently find a way to save costs and improve the level of automation. So by then, automatic BGA repair table, automatic tin removal machine, automatic ball planting machine and other automatic equipment will be widely used.

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