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Two more popular planting ball methods, one is solder paste + tin ball method, the other is solder paste + tin ball method. In fact, the two bga planting methods are much the same, the latter is just to replace the solder paste into a solder paste. But the performance characteristics of the solder paste and solder paste is very different, the solder paste at the temperature rise to the melting point will become liquid, tin ball is easy to flow away with the liquid; In addition, the weldability of the welding paste is relatively poor, not the real sense of solder, so more or the use of solder paste + tin ball method. In addition, these two methods of planting the ball are to use the planting tee to complete.
First of all, explain the BGA planting method, tin paste + tin ball method, the specific operation steps are as follows:
1. First prepare the ball planting tool and planting the ball seat, clean it with alcohol and then dry it, which is conducive to smooth rolling of the tin ball;
2. Position the pre-arranged chip on the planting tee;
3. Return the tin paste to the heat, mix it evenly, and then pour it evenly on the scraper;
4. Put the solder paste printing frame on the positioned base and print the solder paste, try to control the Angle, strength and scraping speed of the scraper, and carefully remove the solder paste frame after completion;
5. Confirm that each pad on the BGA is evenly printed with tin paste, then put the tin ball frame on the positioning, and then put the tin ball, shake the planting tee, let the tin ball roll into the mesh, confirm that each mesh has a tin ball can be collected and off the plate;
6. Remove the BGA of the steel planting ball from the base to be heated. It is better to use reflow welding, or use a hot air gun when the amount is small. So you're done planting the ball.
The second BGA planting method, welding paste + tin ball method, the specific operation steps are as follows:
1. First prepare the ball planting tool and planting the ball seat, clean it with alcohol and then dry it, which is conducive to smooth rolling of the tin ball;
2. Position the pre-arranged chip on the planting tee;
3, use the brush to dip directly into the welding paste, do not need to use steel mesh printing, but directly and evenly coated on the pad of BGA.
4. Confirm that each pad on the BGA is evenly printed with tin paste, then put the tin ball frame on the positioning, and then put the tin ball, shake the planting tee, let the tin ball roll into the mesh, confirm that each mesh has a tin ball can be collected and off the plate;
5. Remove the BGA of the steel planted ball from the base to be heated, and it is better to use reflow welding, or use a hot air gun when the amount is small. So you're done planting the ball.
Comparison of the two methods of BGA planting ball technology: the two steps of the end are the same, the difference is that the solder paste + tin ball method of the 3-4 step and the solder paste + tin ball method of the third step.
About BGA planting balls, should also pay attention to the efficiency of planting balls, the use of Da Tai Feng technology of automatic planting machine, planting efficiency will be greatly increased.
Founded in March 2009, Shenzhen Dataifeng Technology Co., Ltd.
