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BGA packaging technology belongs to the embodiment of integration technology progress, this technology started from the substrate dispensing is used, BGA packaging technology also follow the filling demand of electronic chip and improve, is characterized by the adoption of ball shed array to meet the needs of more and more pin chip packaging.
Mixing glue may affect the effect of BGA package chip
Special mixing glue can be used to flow into the interior, because the glue property after mixing is stronger, can meet the chip BGA packaging filling effect, so the packaging effect of mixing glue is more complete.
In order to prevent glue from flowing into the board before encapsulation and gluing, the manufacturer also needs to adopt packing technology for sealing treatment. In order to ensure the chip filling requirements, the greater the role of BGA packaging technology, because the PCB board needs to be heated, the heating will make the glue gradually melt, causing the glue to penetrate into the middle of the shed array, so that the chip on the PCB board appears glue-free state. It directly affects the quality of PCB glue filling chip.
In this state, BGA encapsulation can not be heated when filling glue, until the mixed glue is completed into the welding ball array package, this is generally the use of high temperature curing, in order to reduce the glue fluidity affect the chip filling quality, in the dispenser to preheat, so as to reduce the fluidity of glue filling package.
Reduce adverse effects in BGA packaging
After high temperature baking, the glue surface on PCB board will boil and produce bubbles, which is caused by uneven mixing glue. To solve this problem, the PCB board needs to be treated at high temperature before dispensing, which can reduce the generation of glue bubbles. The glue can also be fully stirred to remove the influence of bubbles on the chip filling package.
The effect of mixing glue on BGA packaging
Glue after curing but found that the curing effect of glue is poor, because the glue and solder paste used in the dispensing machine mixed and stirred together, so that the glue can not solidified for gluing affect the effect of BGA packaging, found that this situation can be solved by baking board, if the above problems are excluded and glue curing is incomplete, there are two situations caused by.
First of all, the use method is incorrect in the operation process of workers, resulting in sweat and oil spots on the PCB board, which affects the curing effect of the chip package. Secondly, the quality of the mixed glue expired and affect the filling effect.
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