Description of the method of using BGA repair table to dismantle welding:
1. Preparation for repair: for BGA chips to be repaired, determine the air nozzle suction nozzle to be used.
2. Set the diswelding temperature and store it so that it can be called directly when repairing in the future.
3. Switch to the disassembly mode on the touch screen interface, click the repair button, and the heating head will automatically come down to heat the BGA chip.
4. After the temperature curve of the repair platform is finished, the suction nozzle will automatically suck up the BGA chip, and then the mounting head will suck up the BGA and rise to the initial position. The operator can connect the material box with BGA chip.
The welding is complete.
This is how to remove welding using BGA repair table. Mounting welding, the use of welding is not difficult. General manufacturers will be equipped with instructions, follow the instructions of the operation is good, like Da Tai Feng technology BGA repair desk usually have technical staff on-site guidance teaching.
Bottom line: Practice and think, you will find that the BGA repair table is so simple to use.
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