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Six points for attention when choosing BGA repair equipment

February 03, 2023

With the development of technology, in this era of BGA repair equipment has gradually replaced the wind gun, we need to spend more efforts when selecting BGA equipment. So what should we pay attention to when choosing this kind of product? To solve this problem, we have divided the following content into six points for you to answer.

Note one: from the machine operation control system to consider


The operation control system of the machine generally has instrument, touch screen, computer control. The operation of the instrument is too complicated, the price of the computer is relatively expensive, and the touch screen is relatively practical.


Note two: from the BGA chip size to consider


Choose the right size machine for the BGA chip, the bigger the better.


Note three: Select by temperature accuracy


As we all know, temperature accuracy is the core of BGA repair equipment, and the industry standard is plus or minus 3 degrees. The smaller the temperature difference, the better, you can use the furnace temperature tester simulation test.


Note four: the upper infrared heating equipment can be selected


On this recommendation, mainly because there are many kinds of BGA, the classification is wide, to deal with a variety of different BGA, the requirements of convenience, precision, high efficiency, it is recommended to choose the upper infrared heating equipment.


Note five: by making plate area to choose


If the plate area is too small, the board can not be well preheated, it is easy to cause deformation, foaming, yellowing, fault and other problems. So when choosing BGA equipment, it is necessary to choose the plate area.


Note six: Warm area of the equipment


Different temperature zones can be applied to different ranges. For example, the three temperature zone is the upper and the lower part of the BGA chip for local heating, the bottom for the whole plate preheating. Two temperature zone less lower temperature zone, do small or simple BGA chip success rate is OK, like iron shell package or BGA chip is relatively large, two temperature zone is difficult to meet.


After the introduction of the above six matters, is it more directional when you choose BGA repair equipment?

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