Common Welding Faults and Their Causes in the Use of BGA Rework Table

March 09, 2023

In the process of using the BGA rework station, sometimes there will be some faults, which often fail to achieve the desired results, resulting in the failure of rework. Only by finding out the reasons can we come up with solutions to improve the quality, improve the repair process and avoid causing greater losses to the enterprise.According to the causes, the welding failures in the process of BGA repair are generally divided into two categories. Class is caused by the product quality of the machine itself. There are many possible problems with the machine itself, and here are just a few for a brief discussion. For example: the temperature accuracy is not accurate enough, or the mounting accuracy is not accurate, the material is thrown, and the suction nozzle crushes the motherboard.The machine itself is the foundation, if there is no excellent quality equipment, even experienced equipment operators will repair defective products. Therefore, in the production process of equipment, every link must be strictly controlled, and there must be standardized quality supervision. The second category is caused by operator error. For each type of BGA rework station, the two core systems are the alignment system and the temperature control system.When the non-optical BGA rework station is used, the alignment between the BGA chip and the bonding pad is manually completed. The bonding pad with the silk screen can align the silk screen line. If there is no silk screen line, it depends entirely on the operator's experience and perception, and the human factor is dominant.Temperature control is also a very important reason. When desoldering, be sure to absorb BGA when each BGA solder ball is melted, otherwise the result will be that the solder joint on the pad will be pulled off, so remember that the temperature is too low. At the time of soldering, it is necessary to ensure that the temperature is not too high, otherwise the phenomenon of tin connection may occur.Excessive temperature may also cause bulging of BGA surface or PCB pads, which are undesirable phenomena during rework. Therefore, in actual operation, technicians should standardize the use of BGA rework table, and can not change the temperature at will. Technicians must understand some basic knowledge of BGA rework and SMT process.


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