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There are two popular methods, one is solder paste + solder ball method, and the other is solder paste + solder ball method.In fact, the two BGA ball planting methods are similar, the latter just replaces the solder paste with flux paste.However, the performance characteristics of solder paste and solder paste are very different. When the temperature rises to the melting point, the solder paste will become liquid, and the solder ball is easy to flow away with the liquid. In addition, the solderability of the solder paste is relatively poor, so it is not a real solder, so the method of solder paste + solder ball is more often used.In addition, these two ball planting methods can only be completed with the help of the ball planting seat.
First, explain the BGA ball planting method, solder paste + solder ball method. The specific operation steps are as follows: 1. First prepare the ball planting tool, which should be cleaned with alcohol and dried to facilitate the smooth rolling of the solder ball; 2. Position the pre-prepared chip on the ball planting seat; 3. Return the solder paste to temperature, twist and mix it evenly, and then pour it evenly on the scraper;4. Put the solder paste printing frame on the positioned base and print the solder paste, control the angle, force and scraping speed of the scraper as much as possible, and carefully remove the solder paste frame after completion;5. After confirming that each pad on the BGA is uniformly printed with solder paste, put the solder ball frame on and position it, then put the solder ball in, shake the ball planting seat, and let the solder ball roll into the mesh. After confirming that there is a solder ball in each mesh, the solder balls can be collected and removed. 6. Take out the BGA with steel balls from the base for heating. It is better to use reflow soldering. It is also possible to use a hot air gun when the amount is small.This completes the ball planting.
A second BGA ball planting method is a soldering paste + solder ball method, and the specific operation steps are as follows: 1, firstly preparing a ball planting tool and a ball planting seat, cleaning the ball planting tool with alcohol, and drying the ball planting tool to facilitate smooth rolling of a solder ball; 2, positioning a pre-arranged chip on the ball plating seat;3. Use a brush to directly apply the flux paste to the BGA pad without printing with a stencil.4. After confirming that each pad on the BGA is uniformly printed with solder paste, put the solder ball frame for positioning, then put in the solder ball, shake the ball planting seat, and let the solder ball roll into the mesh. After confirming that there is a solder ball in each mesh, the solder balls can be collected and removed. 5. Take out the BGA with steel balls from the base for heating. It is better to use reflow soldering. It is also possible to use a hot air gun when the amount is small.This completes the ball planting.Comparison of the two methods of BGA ball placement technology: the two finishing steps are the same, and the difference lies in step 3-4 of the solder paste + solder ball method and step 3 of the solder paste + solder ball method.About BGA ball planting, we should also pay attention to the efficiency of ball planting. Using the automatic ball planting machine of Dataifeng Technology, the efficiency of ball planting will be greatly increased.
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