A large number of BGA chip rework companies can consider the product features such as automatic rework, temperature control (which is what we often call three-zone temperature control), and optical alignment rework when choosing BGA rework tables. What is the basis for customers to decide the model specifications and configuration when choosing.In this article, the editor of Dataifeng BGA rework station will tell you about the standard requirements for a large number of BGA chip rework companies to choose BGA rework station.
1. According to the number of BGA chips to be repaired, the repair quantity of the BGA rework station is determined by the specific chip repair test of the purchasing customer, which is absolutely not subjective. Therefore, the customer must make a specific plan before purchasing the BGA rework station equipment, including research and analysis, equipment type confirmation, repair quantity, repair yield, etc.Avoid the problem that there is no basis at all when confirming the BGA rework platform, and the purchase of subjective assumptions will cause the purchased equipment to be unable to meet the rework requirements, resulting in increased operating costs.
2. According to the size of the chip to be repaired, it is decided whether it belongs to the BGA chip repair of the large board or the BGA chip repair of the small board.
3. According to the repair efficiency requirements of BGA chips, if your company has a relatively high repair efficiency for BGA chips, needs to reduce labor costs, and chooses automatic operation repair, then you can choose Dataifeng BGA repair table DT-F750.If your rework efficiency is not very high, then you can choose the manual BGA rework table.
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