Cause analysis of multi-tin solder joints 1.The welding temperature is low, so that the viscosity of the molten solder is too large.2. that preheat of the PCB is low, and the components and the PCB absorb heat dure soldering, so that the actual soldering temperature is reduced.3. The activity of the flux is poor or the proportion is too small, causing the solder to be concentrated in one piece and unable to spread out.4. Poor solderability of pads, insertion holes or pins, insufficient infiltration, resulting in bubbles wrapped in solder joints.5. The proportion of tin in the solder decreases, or the composition of Cu increases, the viscosity of the solder increases, and the fluidity of tin becomes worse.6. There is too much solder tin slag, which causes the solder alloy to wrap the tin slag and stay on the solder joint, so the solder joint becomes larger.
Solder spot multi-tin improvement countermeasures 1.Adjust and select the welding peak temperature and welding time reasonably.2. Set the preheating temperature according to the PCB size, board layer, number of components, whether there are mounted components, etc.3. Replace the flux or adjust the appropriate proportion.4. Improve the processing quality of PCB board, components first-in first-out, do not store in humid environment.5. adjust that composition of the solder alloy.6. Clean up the tin slag before the end of each shift.
BE MY FRIEND:Check out my email address: email@example.com!are you avoiding Professional BGA Repair Station Manufacturer mistakes?#dataifeng #BGA rework station #manufacturer #factory #factorywork