Today, let Xiaobian give you an in-depth analysis of the SMT BGA chip repair process and tools. I hope it will be beneficial to you. First, the BGA chip repair process guide.This paper mainly describes the operation process of BGA desoldering and ball placement and the matters needing attention in the maintenance process.II. Description of BGA chip repair process The following points should be kept in mind during BGA repair: ① To prevent over-temperature damage during desoldering, the temperature of the hot air gun should be adjusted in advance during desoldering. The required temperature is (280 ~ 320 ℃). It is forbidden to adjust the temperature when desoldering.② In order to prevent electrostatic accumulation and damage, electrostatic wristband must be worn before operation.③ Prevent the air flow and pressure of the hot air gun from being damaged. The air flow and pressure of the hot air gun shall be adjusted in advance during the welding. It is forbidden to adjust the air flow or pressure during the welding.④ Prevent the BGA pad on the PCBA from being damaged. During the desoldering process, use tweezers to gently touch the BGA to confirm whether the tin is molten. If the tin is molten, remove it. If the tin is not molten, continue to heat it to molten tin.Note: During operation, touch gently and do not use force.⑤ Pay attention to the positioning and direction of BGA on PCBA to prevent secondary ball mounting.3. Basic equipment and tools used in BGA maintenance are as follows: ① Intelligent hot air gun.(Used to remove BGA) ② Anti-static maintenance table and electrostatic bracelet.(Before operation, you must wear an electrostatic bracelet and operate on the anti-static maintenance desk.) ③ Anti-static cleaner.(For BGA cleaning) ④ BGA rework station.(For BGA welding) ⑤ High temperature box (for PCBA board baking) Auxiliary equipment: vacuum suction pen, magnifying glass (microscope).
So the above is the introduction of SMT BGA chip repair process and tools. I hope it will be beneficial to you.
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