The method that BGA plants a ball has a lot of kinds, today, will tell everybody, common 3 kinds plant a ball means: one, scrape tin to become a ball: 1, the residual tin above the BGA chip solder pad that will be removed is cleaned up, use wash board water to clean chip standby.2. Put the chip on the base of the ball planting table and fix it. Align the tin frame steel mesh with the chip pad and fix it. Then print the solder paste on the BGA position. After that, take down the BGA, heat the BGA chip on the heating platform and blow it into balls with a hot air gun.2. Scrape the tin and plant the ball: 1. Put the chip on the base of the ball planting table and fix it.Align the opening of the steel mesh with the chip pad and fix it (2 steel meshes, one tin scraping mesh and one mesh planting net are required).2. Scrape the solder paste on the corresponding steel mesh above the chip pad, and then remove the steel mesh.3. Put the steel mesh on it, pour in the solder balls, shake the solder balls back and forth, make sure that each BGA pad is covered with solder balls, and then take off the chip.Apply heat using a heat gun or heat table or reflow soldering.Balling.3. Solder paste + solder ball: 1. Put the chip on the base of the ball planting table and fix it.Apply soldering paste on the chip.(A thin layer is enough.) Cover the ball placement steel mesh, pour in the solder balls, shake the ball placement mesh back and forth, and confirm that the solder balls are stuck on each BGA pad, and then the off-target is completed. Heat it with a heating table or reflow soldering.Hot air gun assisted balling.0755-36842859 https://www.dataifeng.cn/ The above is a common way to plant the ball, have you learned it?
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