Overview and advantages of BGA rework station.The full name of BGA is Ball Grid Array (BGA), which is to make array solder balls at the bottom of the package substrate as the I/O terminal of the circuit to interconnect with the printed circuit board (PCB).BGA is a kind of chip packaging technology. The machine and equipment for reworking BGA chips are called BGA reworking tables, and the scope of reworking includes a variety of packaged chips.BGA is based on the ball grid array structure to enhance the characteristics of digital devices and reduce the size of products.All digital devices based on this packaging technology have the same characteristics, that is, small size, strong features, low cost and powerful functions.The BGA rework station is the equipment used to repair the BGA chip.
First of all, the repair pass rate is high.In the process of repairing BGA, the success rate of Dataifeng Intelligent Optical Alignment BGA Rework Table can be very good.At present, the popular ways to do well are full infrared, full hot air and two hot air and one infrared. In China, the way to do well on the BGA rework table is usually upper and lower hot air, and the bottom edge infrared preheats three temperature zones.The method is mainly adopted, the upper and lower heads are prepared according to the heating wire and the hot air is led out according to the airflow, and the bottom edge preheating can be divided into a dark infrared heating pipe, an infrared heating plate or an infrared light wave heating plate to heat the whole PCB.On the other hand, it is easy to operate.Use the BGA rework station to repair BGA, and you can become a BGA rework master in seconds.Then there are the fixture for holding the PCB board and the lower PCB support frame, which play an important role in fixing and supporting the PCB board and preventing the board from deforming.According to the screen to do a good job of optical precision alignment, as well as automatic welding and automatic desoldering and other functions.Under normal circumstances, it is very difficult to weld the BGA well, and the most important thing is to do a good job of welding according to the temperature curve.This is also the crucial difference between using BGA rework table and hot air welding gun to disassemble and weld BGA.At present, most of the BGA rework tables can be reworked directly according to the set temperature, while the hot air welding gun can control the temperature, but it can not intuitively observe the real-time temperature, and sometimes it is easy to burn out the BGA directly.It is difficult to destroy the BGA chip and PCB board with the BGA rework station.We all know that in the process of repairing BGA, high temperature heating is required. At this time, the temperature control accuracy is particularly high. A slight deviation may cause the BGA chip and PCB board to be completely scrapped.The temperature control accuracy of the BGA rework table can be accurate to within 2 degrees, so as to ensure the integrity of the chip in the process of reworking the BGA chip, which is also one of the functions that the hot air welding gun can not be compared.The ultimate core of our success in reworking BGA is the problem of temperature and board deformation around reworking, which is a crucial technical issue.The equipment greatly avoids the influence of human factors, so that the repair success rate can be improved and maintained stable.
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