With the rapid development of electronic technology and the increasing popularity of the fine industry, the miniaturization of packaging has become more and more common, and the demand for packaging technology has become more and more common. How to test the quality of products after packaging has become a major difficulty, which requires the market to adopt more up-to-date testing technology.As far as SMT packaging inspection is concerned, X-RAY inspection technology is relatively perfect. If the technology is relatively high, it is CT scanning, which is also quite expensive for the cost of inspection.
In the past, because of the backward technology, the industry tends to be large, and the naked eye can judge whether the product is abnormal or not, but now the market consumers have high requirements for the product, it is not feasible without more refined detection technology, and then there are magnifying glasses and AO optical detection, which to some extent make up for the vacancy in the inspection market, but for people.AO seems a little weak.With the development of science and technology, X-RAY testing equipment came into being, which used to be used for medical testing, with the improvement of processing into industrial testing equipment, X-RAY as a penetration test, you can see the internal defects that are blocked, such as the gold wire inside the chip after packaging, whether the copper wire inside the wire is broken or not, and so on.It is of great significance to the improvement of SMT process, such as insufficient solder, bridge, monument, solder shortage, air hole, device leakage, etc., especially the hidden component inspection of solder joints such as BGA CSP, and X-ray inspection equipment has developed rapidly in recent years, from 2D inspection in the past to 3D inspection, with SPC statistical control function.It can be connected with assembly equipment to realize real-time monitoring of assembly quality.This detection method can ensure the integrity of the SMT process to a certain extent, and avoid the product damage caused by removing the board and re-testing due to error finding.
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