DT-F101P automatic ball planting equipment

The impact block of the sand making machine is directly forged with imported high-quality alloys. Its wear resistance and toughness are at the leading level in China, which greatly improves the work efficiency. The service life is 3 to 5 times higher than that of high manganese steel, which improves the production output and quality.

  • Power Supply: AC220±10%,50/60HZ
  • Weight: 200KG

Product Overview:

DT-F101P is a high precision semi-automatic ball planting machine. In the production of surface assembly process (SMT), it is a special production equipment for large-scale high-precision chip implantation.

 

1. Basic characteristics of the product:

 


(1), suitable for ball implantation of batch chips.

(2) High positioning accuracy, repeat positioning accuracy ± 0.01mm; ball-planting accuracy 0.015mm.

(3), PLC control can improve production efficiency, control quality and save costs:

     Positioning of steel grid for electric lifting platform;

    Semi-automatic falling ball

 (4) The imported electric lifting platform controls the separation speed and stroke of the mold from the stencil, which can flexibly realize a variety of demolding methods.

(5), One-piece fixture fixed positioning system, steel mesh positioning is convenient, fast and accurate.

(6), the thickness of the chip can be adjusted by electric platform.


2, ball planting range

(1), IC: Support SOP, TSOP, TSSOP, QFN and other packages, the minimum pitch (Pitch) is 0.3mm;

  Support BGA, CSP package, minimum ball diameter (Ball) 0.2mm;


3. Application

Manufacturing of mobile phones, communications, LCD TVs, set-top boxes, home theaters, automotive electronics, medical power equipment, aerospace and other products / equipment, and production and processing of general electronic products.


performance

Repeated positioning accuracy: ± 12μM


Ball-planting accuracy: ± 15μM


Cycle time: <30S (excluding chip mounting template time)


Template specifications

Base size: 160 * 240mm


Base thickness: 30mm


Template size: 120 * 160mm


Template thickness: 5mm


Maximum base weight: 5KG


Stencil size range: 270 * 380mm


Stencil thickness: 20 ~ 40mm


Chip fixing: positioning frame and vacuum suction


Mechanical parameter

Feeding speed: 10 ~ 25MM / sec


Demolding speed: 0.1 ~ 15MM / sec


Ball planting speed: 3000 PCS / H (related to the design of the template)


Device parameters

Power supply: AC220 ± 10%, 50 / 60HZ


Compressed air: comes with a vacuum pump


Working environment temperature: -20 ℃ ~ + 45 ℃


Working environment humidity: 30 ~ 60%


Machine weight: 200KG


Equipment size: 600MM (L) * 520MM (W) * 600MM (H)


Operating system: HMI + PLC


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