The impact block of the sand making machine is directly forged with imported high-quality alloys. Its wear resistance and toughness are at the leading level in China, which greatly improves the work efficiency. The service life is 3 to 5 times higher than that of high manganese steel, which improves the production output and quality.
Product Overview:
DT-F101P is a high precision semi-automatic ball planting machine. In the production of surface assembly process (SMT), it is a special production equipment for large-scale high-precision chip implantation.
1. Basic characteristics of the product:
(1), suitable for ball implantation of batch chips.
(2) High positioning accuracy, repeat positioning accuracy ± 0.01mm; ball-planting accuracy 0.015mm.
(3), PLC control can improve production efficiency, control quality and save costs:
Positioning of steel grid for electric lifting platform;
Semi-automatic falling ball
(4) The imported electric lifting platform controls the separation speed and stroke of the mold from the stencil, which can flexibly realize a variety of demolding methods.
(5), One-piece fixture fixed positioning system, steel mesh positioning is convenient, fast and accurate.
(6), the thickness of the chip can be adjusted by electric platform.
2, ball planting range
(1), IC: Support SOP, TSOP, TSSOP, QFN and other packages, the minimum pitch (Pitch) is 0.3mm;
Support BGA, CSP package, minimum ball diameter (Ball) 0.2mm;
3. Application
Manufacturing of mobile phones, communications, LCD TVs, set-top boxes, home theaters, automotive electronics, medical power equipment, aerospace and other products / equipment, and production and processing of general electronic products.
performance
Repeated positioning accuracy: ± 12μM
Ball-planting accuracy: ± 15μM
Cycle time: <30S (excluding chip mounting template time)
Template specifications
Base size: 160 * 240mm
Base thickness: 30mm
Template size: 120 * 160mm
Template thickness: 5mm
Maximum base weight: 5KG
Stencil size range: 270 * 380mm
Stencil thickness: 20 ~ 40mm
Chip fixing: positioning frame and vacuum suction
Mechanical parameter
Feeding speed: 10 ~ 25MM / sec
Demolding speed: 0.1 ~ 15MM / sec
Ball planting speed: 3000 PCS / H (related to the design of the template)
Device parameters
Power supply: AC220 ± 10%, 50 / 60HZ
Compressed air: comes with a vacuum pump
Working environment temperature: -20 ℃ ~ + 45 ℃
Working environment humidity: 30 ~ 60%
Machine weight: 200KG
Equipment size: 600MM (L) * 520MM (W) * 600MM (H)
Operating system: HMI + PLC
