DT-F900 Rework Station Overview
● DT-F900 is a small and large (small board that can be reworked 800mmX800mm) with optical alignment system. It adopts infrared plus gas (including nitrogen or compressed air) mixed heating method. All actions are driven by motor and software. Controlled desoldering integrated rework station. Used for desoldering all kinds of package chips. Applicable to any BGA device, special and difficult to repair components POP, CCGA, BGA, QFN, CSP, LGA, Micro SMD, MLF (Micro Lead Frames).
● Independent six-axis linkage, seven motors drive all actions. The upper and lower temperature zone / PCB movement and X / Y movement of the optical alignment system are controlled by the joystick, which is easy to operate. With memory function, suitable for batch rework to improve efficiency and high degree of automation.
● Integrated design of heating head and placement head, with automatic rotation, registration, welding and automatic disassembly;
● The upper air head adopts a 4-channel hot air heating system, plus a 2-channel independent cooling system. The temperature rises fast, the temperature is uniform, and the cooling is rapid (50-80 degrees when the temperature drops), which better meets the requirements of lead-free soldering processes. The lower hot temperature area is heated by infrared + hot air. Infrared rays directly affect the heating area and are conducted at the same time as the hot air, which can make up for each other's deficiencies and make the PCB heat up quickly (the heating rate reaches 10 ° C / S), while the temperature remains uniform.
● Independent three temperature zone (upper temperature zone, lower temperature zone, infrared preheating zone), the upper temperature zone and lower temperature zone can be synchronized and automatically moved, and it can automatically reach any position in the bottom infrared preheating zone. The lower temperature zone can be moved up and down to support the PCB and is automatically controlled by a motor. The PCB is not moved on the fixture, and the upper and lower heating heads can be moved to the target chip on the PCB as a whole.
● Original bottom infrared preheating platform, using Germany imported excellent heating material (infrared gold-plated light tube) + anti-glare thermostatic glass (temperature resistance up to 1800 ° C), preheating area of 500 * 420 mm
● The preheating platform, splint device and cooling system can move automatically in the X direction as a whole. Make PCB positioning and desoldering safer and more convenient.
● X and Y direction mobile and overall unique design, make full use of equipment space, achieve relatively large area PCB repair with relatively small equipment volume, the largest plywood size can reach 630 * 610mm, no dead corner for repair;
● The splint device has a positioning scale, and the system can memorize the historical positioning scale, making repeated positioning more convenient and quick.
● Built-in vacuum pump, Φ axis angle can be rotated arbitrarily, high-precision stepper motor control, automatic memory function, precision fine-tuning placement nozzle;
● The nozzle automatically recognizes the suction and placement height, and the pressure can be controlled within a small range of 10 grams. It has the function of 0 pressure suction and placement, which is aimed at smaller chips;
● Color high-definition optical vision system with spectroscopic two-color, magnification and fine-tuning functions, including chromatic aberration resolution device, autofocus, software operation functions, 22x optical zoom, and maximum repairable BGA size 70 * 70mm;
● The temperature control method breaks the previous on-off control (On-off control: It controls the temperature of the heating body through the solid-state on-off time; when heating, the heating body power is frequently switched between 0 or 100% to control the temperature of the heating body. , The temperature fluctuation is relatively large), this machine uses analog quantity control (is the continuous control of the power of the heating body through the analog value, from 0-100% continuously adjustable power of the heating body to achieve stable and accurate temperature control), At present, high-end reflow soldering adopts this heating control method: computer + PLC control; embedded industrial computer, touch screen human-machine interface. PLC control, real-time temperature curve display, can display set curve and measured curve, can analyze temperature measurement curve;
● 10-segment rise (fall) temperature + 10-segment constant temperature control, mass storage of temperature curve, curve analysis can be performed on the touch screen;
● Various sizes of alloy hot air nozzles are easy to replace and can be positioned by 360 ° rotation.
● Configure 5 temperature measurement ports with multi-point real-time temperature monitoring and analysis functions.
● Equipped with nitrogen inlet, which can be connected with nitrogen protective welding, making the repair more safe and reliable.
● Use a fixture with positioning scale to complete the automatic chip picking and disassembling. As long as the chip size is entered on the operation screen, the upper tip will automatically suck the chip center position, which is more suitable for mass production.
● With solid-state operation display function, making temperature control more secure and reliable;
● The machine can automatically generate SMT standard temperature disassembly curve under the temperature of different regions and different environments, without manually setting the machine curve, it can be used by operators with or without experience to realize intelligent machine.
● With camera to observe the melting point on the side of the solder ball, it is convenient to determine the curve. (This function is optional).
● With optional function:
1. It can make the heating area and the adjacent area produce a temperature difference of 30 ° C with a long duration, which can better protect the smaller BGA from reaching the melting point. This function is designed for rubber plates of mobile phones and notebooks.
2. The existing semi-automatic optical system can be replaced by a fully automatic optical system;
3. The existing embedded industrial control computer control can be replaced by a computer general-purpose software control, which is compatible with printers and strip scanning;
4. The existing automatic functions of PCBX, Y and optical systems can be replaced by manual, which reduces costs and is economical to meet more customers who need to repair large boards;
DT-F900 rework station device specifications:
1.Equipment model DT-F900
2. Maximum PCB size: W800 * D800mm
3. PCB thickness: 0.5 ～ 8mm
4. Applicable chip: 1 * 1 ～ 70 * 70mm
5. Minimum chip spacing: 0.15mm
6, the maximum load: 300g
7, placement accuracy: ± 0.01mm
8. PCB positioning method: shape or positioning hole
9. Temperature control method: K-type thermocouple, closed-loop control
10, lower hot air heating: hot air 800W
11. Upper hot air heating: hot air 1200W
12. Preheating at the bottom: Infrared 6000W
13. Power supply: three-phase 380V, 50 / 60Hz
14. Machine size: L970 * W700 * H1400mm (without bracket)
15. Machine weight: about 170KG
DT-F900 rework station random distribution information and after-sales service:
1) An operating manual
2. After-sales training content
1) Equipment installation and adjustment
2) Equipment operation
3) Equipment adjustment and parameter setting
4) Equipment maintenance
5) Equipment failure
6) Replacement of vulnerable parts of equipment
7) Other matters needing attention
The equipment is guaranteed for one year under normal use, including installation and commissioning and personnel training after the machine arrives at the factory. It also provides lifetime technical support and services.
1) Anisotropic plate fixture
2) Alloy hot air nozzle
3) Two kinds of flaps (to reduce the preheating area)
4) Solder paste
5) solder ball
6) Universal plant stand
7) Allen wrench