DT-F800 Feature & Parameter:
1. The integrated design of the hot air head and the placement head has the functions of automatic placement, automatic welding and automatic disassembly.
2. The upper air head adopts a hot air system, which heats up quickly, the temperature is uniform, and the cooling is rapid (50-80 degrees can be dropped suddenly when the temperature is lowered), which better meets the requirements of lead-free soldering processes. The lower hot temperature zone is mixed with infrared + hot air. The infrared directly acts on the heating area and conducts with the hot air at the same time. This can make up for each other's shortcomings and make the PCB heat up quickly (the heating rate reaches 10 ° C / S), while the temperature remains uniform.
3. Independent three temperature zone (upper temperature zone, lower temperature zone, infrared preheating zone), the upper temperature zone and lower temperature zone can be synchronized and automatically moved, and it can automatically reach any position in the bottom infrared preheating zone. It moves up and down, supports the PCB, and adopts automatic control of the motor to make the PCB not move on the fixture. The upper and lower heating heads can be moved to the target chip of the PCB as a whole.
4. The PCB card board uses high-precision sliders to ensure the placement accuracy of BGA and PCB boards.
5. Original bottom preheating platform, using Germany imported excellent heating material (infrared gold-plated light pipe) anti-glare constant temperature glass (temperature resistance up to 1800 ℃), preheating area of 500 × 420mm
6. The preheating platform, plywood device and cooling system can be moved in the X direction as a whole, making PCB positioning and folding welding safer and more convenient.
7, X, Y adopts the motor automatic control movement mode, which makes the alignment fast and convenient, the equipment space is fully utilized, and the large surface is achieved with a relatively small equipment volume
8. Double joystick control, alignment lens and upper and lower heating platform, so as to ensure alignment accuracy.
9, built-in vacuum pump, φ angle rotation, precision fine-tuning placement nozzle.
10. The nozzle automatically recognizes the suction and placement height, and the pressure can be controlled within a small range of 10 grams. It has the function of 0 pressure suction and placement, for smaller chips,
11. The color optical vision system has manual X and Y direction movement, with spectroscopic two-color, zoom and fine adjustment functions, including color difference resolution device, auto focus, software operation functions, 22 times optical zoom, and can be repaired up to a maximum BGA size 80 × 80 mm
12, 10-segment rise (fall) temperature + 10-segment constant temperature control, massive curves can be stored, and curve analysis can be performed on the touch screen.
13. Various sizes of alloy hot air nozzles are easy to replace and can be positioned by 360 ° rotation.
14. Configure 5 temperature measurement ports, with multi-point real-time temperature monitoring and analysis functions.
15. With solid-state operation display function, making temperature control more secure and reliable.
16. The machine can automatically generate the SMT standard temperature disassembly curve under the temperature of different environments in different regions. There is no need to manually set the machine curve. It can be used by operators with or without experience to realize machine intelligence.
17, with a camera to observe the melting point on the side of the solder ball, easy to determine the curve (this function is optional).
Maximum PCB Size
Applicable PCB thickness
Applicable chip size
Minimum chip pitch
Mounting maximum load
Shape or positioning hole
K-type thermocouple, closed loop control
Botoom hot air heating
Upper hot air heating
Bottom infrared preheat