深圳市达泰丰科技有限公司官网
18038121890or19146440969
商务合作:dtf2009@126.com
深圳市达泰丰科技有限公司官网
Log In
Register
18038121890or19146440969
商务合作:dtf2009@126.com
Home Page
Category
全部
BGA Desoldering Process
Chip Processing Technology
Chip Mounting Process
Case & Application
About Us
全部
Introduction
Culture
Leave A Message
Certification
Contact Us
News
全部
What's New
Industrial Information
Industrial Advantage
全部
Advanced Technology
Technological Superiority
High Quality Service
Human Resources
Contact Us
Technical Support
简体中文
Category
您的位置:
Home Page
Category
Chip Processing Technology
全部
BGA Desoldering Process
Chip Processing Technology
Chip Mounting Process
Case & Application
Recommendation
Hot
New
PSI Singapore Deoxidation Planting Ball Dedicated Plus Soldering BGA Welding BGA Reballing BGA Rework Flux
Customized BGA Ball Planting Tin Planting Bead Fixture
Solder ball welding DT-F120S heating platform
DT-F101P automatic ball planting equipment
Chip solder ball melting table DT-F120P
PSI219 solder paste for rework soldering
PSI218 solder paste for rework soldering Singapore formula strong deoxidation and defoaming
Previous Page:
1
Next Page:
转至第
Category
BGA Desoldering Process
Chip Processing Technology
Chip Mounting Process
Case & Application
About Us
Introduction
Culture
Leave A Message
Certification
News
What's New
Industrial Information
Industrial Advantage
Advanced Technology
Technological Superiority
High Quality Service
Contact Us
工作时间
客户热线
13715211798
工作时间
周一到周六8:00-22:00
首页
电话咨询
产品列表
QQ客服