Dataifeng focused on the BGA chip welding technology,BGA balls technical solution equipment tools,bga welding machine.
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Welding equipment refers to the equipment needed to realize the welding process, and different welding equipment. The same weldment can be welded, so we need to choose a more suitable welding equipment based on actual usage. When welding, the energy consumption of welding equipment is considerable. When selecting welding equipment, it should be considered as far as possible to select welding equipment with low power consumption and high power factor under the premise of meeting the process requirements. Welding equipment should be sturdy and durable, with stable working characteristics and good reliability. Welding parameter adjustment is convenient and intuitive, and can maintain stability in the long-term welding process, economical, practical, and easy to maintain.Dataifeng is a professional welding equipment manfacturer,specialized in custom welding equipment, welding machine for sale.Our welding equipment under the conditions of normal use and correct maintenance, the working life should be more than 10 years.


  • DT-F330 BGA rework station used for circuit board chip desoldering and repair DT-F330 BGA rework station used for circuit board chip desoldering and repair
    BGA rework station suitable for perfect welding of chips of different sizes and thicknesses.Three temperature zones, independent temperature control, touch screen independent research and development patented system.
  • DT-F560 BGA rework station used for circuit board chip desoldering and repair DT-F560 BGA rework station used for circuit board chip desoldering and repair
    BGA rework station suitable for perfect welding of chips of different sizes and thicknesses.Three temperature zones, independent temperature control, touch screen independent research and development patented system.
  • ​DT-F330D Full-screen visualized maintenance BGA rework station ​DT-F330D Full-screen visualized maintenance BGA rework station
    BGA rework station is used to repair SMT motherboard chips and IC chip repair.Full screen visual maintenance,with advantages of optical alignment and positioning.
  • DT-F120S Constant temperature intelligent heating platform preheating plate heating plate DT-F120S Constant temperature intelligent heating platform preheating plate heating plate
    Used for chip heating to achieve the effects of tin removal, tin removal, and ball melting.
  • DT-F12  Intelligent High-efficiency Soldering Iron Station DT-F12 Intelligent High-efficiency Soldering Iron Station
    Soldering iron is a kind of hot welding tool, used for welding metal parts, electronic parts, chip soldering tin.
  • 862DW Hot Air Gun Soldering Station 862DW Hot Air Gun Soldering Station
    Hot Air Gun Soldering Station is suitable to the de-soldering of the SMD components,such as SOIC、CHIP、QFP、PLCC、BGA .Suitable for heat shrinkage, drying, paint removal, debonding, thawing, preheating, disinfection, glue welding.
  • 861DW Hot Air Gun Soldering Station 861DW Hot Air Gun Soldering Station
    861DW Hot Air Gun Soldering Station is suitable to the de-soldering of the SMD components,such as SOIC、CHIP、QFP、PLCC、BGA .Suitable for heat shrinkage, drying, paint removal, debonding, thawing, preheating, disinfection, glue welding.
  • 861X Hot Air Gun Soldering Station 861X Hot Air Gun Soldering Station
    861X Hot Air Gun Soldering Station is suitable to the de-soldering of the SMD components,such as SOIC、CHIP、QFP、PLCC、BGA .Suitable for heat shrinkage, drying, paint removal, debonding, thawing, preheating, disinfection, glue welding.
  • 850++ Hot Air Gun Soldering Station 850++ Hot Air Gun Soldering Station
    It is suitable to the de-soldering of the SMD components,such as SOIC、CHIP、QFP、PLCC、BGA .Suitable for heat shrinkage, drying, paint removal, debonding, thawing, preheating, disinfection, glue welding.
  • Automati SMD BGA rework station machine with optical alignment for mobile phone computer ect. Automati SMD BGA rework station machine with optical alignment for mobile phone computer ect.
    DT-F630 features and parameters :1. The upper heating head and the placement head of the machine are integrated design, with automatic welding/automatic removal and automatic placement functions.2. Using a touch screen man-machine interface and PLC control, four temperature curves are displayed at any time, the temperature is precisely controlled at + 1 degree, 9 -stage temperature control, and the excellent temperature control system can better ensure the welding effect.3. There are three temperature zones up and down for independent heating. The first temperature zone and the second temperature zone can simultaneously perform multiple sets of multi-stage temperature control. The third temperature zone enables large-area preheating of the PCB board to achieve the best welding effect.4. The unique PCB support design in the second temperature zone can lift and prevent the defects caused by the collapse of the PCB board during the welding process.5. High-precision K-type thermocouple closed-loop control is selected, and 3 external temperature measurement interfaces are used to achieve precise temperature detection.6. It can store 100+ sets of temperature curve settings, perform curve analysis, and change settings at any time on the touch screen.7. The PCB positioning adopts a V-shaped groove, and the flexible and convenient movable universal clamp protects the PCB.8. To ensure the welding effect, a high-power cross-flow fan is used to quickly cool the PCB board to prevent the PCB board from being deformed.9. After the BGA is desoldered, it has an alarm function. In the case of temperature out of control, the circuit can automatically power off, and it has double over-temperature protection functions.10. The upper heating system and the optical alignment device are controlled by the touch screen, which is convenient and flexible to operate and ensures that the alignment accuracy is controlled within 0.01-0.02mm11. The machine adopts a high-precision optical image alignment system, with zoom-in and zoom-out function and automatic focusing, and is equipped with a 15" color LCD monitor.12. The high degree of automation can avoid human error, and can achieve a unique effect on the rework of lead-free processes and pop packaging and other devices.13. The machine has an over-temperature alarm function, which will automatically cut off the heating after over-temperature.14. High-sensitivity photoelectric switch, which can prevent the heating head from crushing the PCB motherboard during the operation of the equipment.
  • Professional Factory direct customized DT-F560 BGA rework station  for mobile phone ect. manufacturers Professional Factory direct customized DT-F560 BGA rework station for mobile phone ect. manufacturers
    Professional Factory direct customized DT-F560 BGA rework station chips welding machine for mobile phone ect. manufacturers.total power:5200W Independent three-temperature zone 9-segment temperature control Infrared preheating K-type thermocouple closed-loop control web:https://szdtf.en.alibaba.com/ connect me: whatsapp/skype:17877092461
  • What is a BGA Rework Station What is a BGA Rework Station
    What is a BGA Rework Station

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