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Bga rework station machine  can repair the motherboard in high quality and high precision, reduce possibilty of the PCB board burn or turn yellow during the rework process.


  • DT-F330 BGA rework station used for circuit board chip desoldering and repair DT-F330 BGA rework station used for circuit board chip desoldering and repair
    BGA rework station suitable for perfect welding of chips of different sizes and thicknesses.Three temperature zones, independent temperature control, touch screen independent research and development patented system.
  • DT-F560 BGA rework station used for circuit board chip desoldering and repair DT-F560 BGA rework station used for circuit board chip desoldering and repair
    BGA rework station suitable for perfect welding of chips of different sizes and thicknesses.Three temperature zones, independent temperature control, touch screen independent research and development patented system.
  • ​DT-F330D Full-screen visualized maintenance BGA rework station ​DT-F330D Full-screen visualized maintenance BGA rework station
    BGA rework station is used to repair SMT motherboard chips and IC chip repair.Full screen visual maintenance,with advantages of optical alignment and positioning.
  • Automati SMD BGA rework station machine with optical alignment for mobile phone computer ect. Automati SMD BGA rework station machine with optical alignment for mobile phone computer ect.
    DT-F630 features and parameters :1. The upper heating head and the placement head of the machine are integrated design, with automatic welding/automatic removal and automatic placement functions.2. Using a touch screen man-machine interface and PLC control, four temperature curves are displayed at any time, the temperature is precisely controlled at + 1 degree, 9 -stage temperature control, and the excellent temperature control system can better ensure the welding effect.3. There are three temperature zones up and down for independent heating. The first temperature zone and the second temperature zone can simultaneously perform multiple sets of multi-stage temperature control. The third temperature zone enables large-area preheating of the PCB board to achieve the best welding effect.4. The unique PCB support design in the second temperature zone can lift and prevent the defects caused by the collapse of the PCB board during the welding process.5. High-precision K-type thermocouple closed-loop control is selected, and 3 external temperature measurement interfaces are used to achieve precise temperature detection.6. It can store 100+ sets of temperature curve settings, perform curve analysis, and change settings at any time on the touch screen.7. The PCB positioning adopts a V-shaped groove, and the flexible and convenient movable universal clamp protects the PCB.8. To ensure the welding effect, a high-power cross-flow fan is used to quickly cool the PCB board to prevent the PCB board from being deformed.9. After the BGA is desoldered, it has an alarm function. In the case of temperature out of control, the circuit can automatically power off, and it has double over-temperature protection functions.10. The upper heating system and the optical alignment device are controlled by the touch screen, which is convenient and flexible to operate and ensures that the alignment accuracy is controlled within 0.01-0.02mm11. The machine adopts a high-precision optical image alignment system, with zoom-in and zoom-out function and automatic focusing, and is equipped with a 15" color LCD monitor.12. The high degree of automation can avoid human error, and can achieve a unique effect on the rework of lead-free processes and pop packaging and other devices.13. The machine has an over-temperature alarm function, which will automatically cut off the heating after over-temperature.14. High-sensitivity photoelectric switch, which can prevent the heating head from crushing the PCB motherboard during the operation of the equipment.

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