• 861DW Hot Air Gun Soldering Station 861DW Hot Air Gun Soldering Station
    861DW Hot Air Gun Soldering Station is suitable to the de-soldering of the SMD components,such as SOIC、CHIP、QFP、PLCC、BGA .Suitable for heat shrinkage, drying, paint removal, debonding, thawing, preheating, disinfection, glue welding.
  • 861X Hot Air Gun Soldering Station 861X Hot Air Gun Soldering Station
    861X Hot Air Gun Soldering Station is suitable to the de-soldering of the SMD components,such as SOIC、CHIP、QFP、PLCC、BGA .Suitable for heat shrinkage, drying, paint removal, debonding, thawing, preheating, disinfection, glue welding.
  • 862DW Hot Air Gun Soldering Station 862DW Hot Air Gun Soldering Station
    Hot Air Gun Soldering Station is suitable to the de-soldering of the SMD components,such as SOIC、CHIP、QFP、PLCC、BGA .Suitable for heat shrinkage, drying, paint removal, debonding, thawing, preheating, disinfection, glue welding.
  • 850++ Hot Air Gun Soldering Station 850++ Hot Air Gun Soldering Station
    It is suitable to the de-soldering of the SMD components,such as SOIC、CHIP、QFP、PLCC、BGA .Suitable for heat shrinkage, drying, paint removal, debonding, thawing, preheating, disinfection, glue welding.
  • DT-F120S Constant temperature intelligent heating platform preheating plate heating plate DT-F120S Constant temperature intelligent heating platform preheating plate heating plate
    Used for chip heating to achieve the effects of tin removal, tin removal, and ball melting.