With the improvement of semiconductor manufacturing process, it becomes more difficult to detect semiconductor defects. Micrometer-scale electronic semiconductors usually use X-Ray inspection equipment, X-Ray inspection allows real-time imaging, from the inspection image can quickly find the location of defects. However, as the electronic components are getting smaller and smaller, the resolution and magnification of X-Ray detection equipment are also getting higher and higher.
X-Ray testing equipment is mainly used to detect welding problems in semiconductor wiring. Welding is prone to defects such as false welding and leakage welding. Once these defects are formed, the semiconductor is prone to short circuit and other problems. Semiconductor components must be used after welding in order to work properly. Therefore, it is necessary to perform defect detection.
With the development of semiconductor production technology, X-Ray inspection equipment is constantly developed and upgraded, and is committed to providing high quality inspection equipment for electronics manufacturers.
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