For the circuit board industry laser cutting or drilling, only a few watts or more than ten watts of UV laser can be, without kilowatt level laser power, in consumer electronics, automotive industry or robot manufacturing technology, the use of flexible circuit boards is becoming increasingly important. Because UV laser processing system has flexible processing mode, high precision processing effect and flexible and controllable processing process, it has become the first choice of flexible circuit board and thin PCB laser drilling and cutting.
Today, the laser system configuration of long-life laser sources has been basically close to maintenance free, in the production process, the laser level 1, safety without other protection devices. The LPKF laser system is equipped with a vacuum device, which does not cause the emission of harmful substances. Coupled with its intuitive and easy to operate software control, laser technology is replacing traditional mechanical processes, saving the cost of special tools. CO2 laser or UV laser?
For example, when PCB is divided or cut, CO2 laser system with wavelength of about 10.6 μm can be selected. The processing costs are relatively low and the laser power provided can reach several kilowatts. But it generates a lot of heat during the cutting process, resulting in severe carbonization of the edges.
UV laser wavelength is 355 nm. Laser beams of this wavelength are very easy to focus optically. A UV laser with less than 20 watts of laser power focuses a spot just 20μm in diameter -- and produces an energy density comparable even to the surface of the sun.
Advantages of UV laser processing
UV laser is especially suitable for hard board, soft and hard combined board, soft board and its auxiliary materials cutting and marking. So what are the advantages of this laser process?
UV laser cutting system has shown great technical advantages in PCB sub-boards and micro-drilling in PCB industry. Depending on the thickness of the circuit board material, the laser cuts one or more times along the desired contour. The thinner the material, the faster the cutting speed. If the accumulated laser pulse is lower than the laser pulse required to penetrate the material, only scratches will appear on the surface of the material; Therefore, two-dimensional code or bar code can be marked on the material to facilitate the follow-up process information tracking.
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