What is multilayer PCB circuit board, what are the advantages of multilayer PCB circuit board

November 23, 2022

Multi-layer circuit board name incredible is more than two layers of the circuit board can be called multi-layer, before you have analyzed what is double-sided circuit board, so multi-layer board is more than two layers, such as four layers, six layers, eight layers and so on. Of course, some designs are three or five layers of the line, also called multi-layer PCB circuit board. The electrical wiring diagram is larger than the two-layer board, and the layers are separated by insulating substrate. After the lines of each layer are printed, the lines of each layer are overlapped by pressing. Then drill holes, through holes to achieve the transmission between each layer of lines. The advantage of multi-layer PCB circuit board is that the circuit can be distributed in the multi-layer inside the wiring, so that you can design more precise products. Or smaller products can be achieved with multilayer panels. Such as: mobile phone circuit board, projector, voice recorder and other volume of products. In addition, multiple layers can increase the flexibility of the design, which can better control the differential impedance and single-terminal impedance, as well as better output of some signal frequencies.

Multilayer circuit board is the inevitable product of electronic technology to the direction of high speed, multi-function, large capacity and small volume. With the continuous development of electronic technology, especially the extensive and in-depth application of large-scale and ultra-large scale integrated circuits, multilayer printed circuits are rapidly developing to the direction of high density, high precision, high level digitalization and put forward the present micro-line, small aperture through, blind hole buried hole high plate thick aperture ratio technology to meet the needs of the market. Due to the computer and aerospace industry to the need for high speed circuits. It is required to further improve the packaging density, coupled with the reduction of the separation component size and the rapid development of microelectronics, electronic equipment is developing in the direction of reducing the volume and quality; Due to the limitation of available space, it is impossible to achieve further improvement of assembly density in single and double sided printed boards. Therefore, it is necessary to consider using more printed circuits than double panel layers. This has created conditions for the emergence of multi-layer circuit boards.

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