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BGA repair Table: Classification and characteristics of BGA devices

2022/11/26

The application of BGA (Ball Grid Array packaging) has entered the stage of large-scale practical, whether consumer electronics, medical safety products or aerospace and military electronics, has a wide range of applications, followed by an increasing number of BGA components repair types and quantities, this paper focuses on the characteristics of BGA, Combined with the experience in daily maintenance, a brief talk about the BGA repair.

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The application of BGA (Ball Grid Array packaging) has entered the stage of large-scale practical, whether consumer electronics, medical safety products or aerospace and military electronics, has a wide range of applications, followed by an increasing number of BGA components repair types and quantities, this paper focuses on the characteristics of BGA, Combined with the experience in daily maintenance, a brief talk about the BGA repair.

Classification and characteristics of BGA devices

Speaking of BGA repair, first of all, let's have a look at the characteristics of this device. The I/O terminals of the BGA package are distributed under the package in the form of array with circular or cylindrical solder joints. The heating and melting of the solder joints are mainly through the heat conduction between the package body and the PCB.

BGA mainly includes PBGA, CBGA, CCGA and TBGA.

PBGA (plastic BGA) is a plastic encapsulated BGA, which is also the most commonly used BGA at present. It uses solder balls composed of 63/37 (with lead) or 305 (without lead). The melting temperature of solder is 183℃ or 217℃. PBGA has the advantage of being low cost and easy to process, but because of its plastic packaging, it absorbs moisture easily.

The ceramic BGA (CBGA) is a ceramic sealed BGA, which has a certain range of applications. The composition of the CBGA welding ball is 90Pb/10Sn (the solder composition at its connection with PCB is still 63Sn/37Pb). CBGA is a non-fusion welding ball (in fact, its melting point is much higher than the temperature of reflow soldering) on components and printed boards. The diameter of the ball is 0.889mm and the height remains the same. The solder ball of CBGA is less likely to absorb moisture than that of PBGA, and the package is more secure. The solder joint diameter at the bottom of CBGA chip is larger than the solder plate on PCB. After the removal of CBGA chip, the solder will not be on the solder plate of PCB.

The difference between BGA and other types of components is that the solder joint is in the lower part of the element body, and can not be disassembled and welded by conventional tools such as soldering iron, and the disassembly welding process can not see the melting and curing process of the solder joint. This determines the particularity of BGA maintenance.

So the above is about the classification and characteristics of BGA devices, want to know more content, please pay attention to the next!

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