BGA repair platform according to different standards can be divided into a variety of types, the most common are automatic BGA repair platform and manual BGA repair platform, which type of BGA repair platform repair ability? Let's compare them.
What is the difference between automatic BGA repair table and manual BGA repair table?
1. Automatic BGA repair table
Automatic BGA repair table can repair BGA chip maintenance quantity, strong continuity, high reliability. In particular, it can save a lot of labor costs and high maintenance rates. In the maintenance process, the automatic disassembly and welding can be realized quickly without manual operation, which greatly reduces the error caused by manual operation. In addition, automatic BGA repair table with 7 point line automatic generation maintenance temperature curve machine automatic development interface can use the mouse to move the interface of 7 points, draw the ideal temperature curve, the machine will automatically set the parameters of each temperature area according to the temperature curve, quickly generate a safe maintenance curve. The fully automatic BGA repair table features a flexible and easy-to-use PCBA substrate placement platform for servicing PCBA substrates of different sizes and shapes.
2. Manual BGA repair table
The repair yield and repair efficiency of manual BGA repair table are relatively low, which is only suitable for companies with less BGA chip repair or individual repairers. General manual BGA repair table is only able to repair simple BGA chips. The repair requirements with high precision cannot be met, because manual BGA repair table does not have the function of alignment system and temperature automatic curve generation.
To sum up, the automatic BGA repair platform has more powerful repair ability.
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