The BGA repair platform is divided into optical and non-optical alignment, and the optical alignment is imitated through the optical module using a cracked prism. Non-optical alignment is to align the BGA according to the silk screen lines and points of the PCB board by the naked eye to achieve alignment repair.
BGA repair table is a reheating and welding equipment corresponding to the poorly welded BGA. It can not repair the quality problems of the BGA components themselves. However, according to the current technology level, the probability of BGA components factory problems is very low. If there is any problem, the welding defects caused by temperature will only occur at the SMT process end and back section, such as air welding, false welding, false welding, soldering and other welding problems. But many individuals repair laptops, mobile phones, XBOX, desktop motherboards, etc., will also use it.
1. High success rate of repair.
The success rate of optical BGA repair table can reach 100% when repairing BGA. Now the main heating methods are
Full infrared, full hot air and two hot air and one infrared, the heating method of domestic BGA repair table is generally upper and lower hot air, bottom
Part of the infrared preheating three temperature zone (two temperature zone BGA repair table only the upper hot air and the bottom preheating, compared with the three temperature zone
A little behind).
The upper and lower heating heads are heated by heating wire and the hot air is exported by air flow. The bottom preheating can be divided into dark red external heating pipe, infrared heating plate or infrared light wave heating plate to heat the whole PCB board.
2. Simple operation.
Use BGA repair platform to repair BGA, you can change the second BGA repair master. Simple upper and lower heating: heating through hot air, and use the air nozzle to control the hot air. The heat is concentrated on the BGA to prevent damage to the surrounding components, and through the convection of hot air up and down, the probability of deformation of the board can be effectively reduced. In fact, this part is rather like a dry heat gun with an air nozzle, but the temperature of the BGA table can be adjusted according to the set temperature curve.
Bottom preheating board: It plays a preheating role to remove the moisture inside PCB and BGA, and can effectively reduce the temperature difference between the heating center and the surrounding point, and reduce the probability of deformation of the board.
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