Chip is the core component of modern electronic products, the source power of the rapid development of electronic information industry, and the important support of social digital economy construction and information consumption.
BGA is an indispensable part of electronic components, and BGA packaging and welding are particularly important, because in the packaging and welding stage, products are often found to have defects, such as hollow, virtual welding, etc., the existence of defects will seriously affect the use of products, and even become a potential threat to users. Is there a BGA quality nondestructive testing method that can detect defects?
The first method is the visual method. This method uses a high-power magnifying glass to observe the solder joint and judge whether there are defects in the solder joint from the appearance. However, the visual method has very big limitations, and can not detect finer defects is one of them.
The second option is to operate x-ray inspection equipment to observe BGA quality. x-ray inspection is a nondestructive physical perspective method that can achieve the clear detection of internal defects without damaging the product. Nowadays, many enterprises use this method to test the quality of their products, which is very efficient and high quality.
Then the above is the introduction of BGA quality nondestructive testing methods, need x-ray nondestructive testing equipment friends, you can contact Da Tai Feng technology to understand ~
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