In PCBA, the most common line failure is virtual welding, also known as cold welding. This kind of fault appears to be welded on the surface, but in fact there is no internal through, or in the middle state of through and through, and finally will affect the circuit characteristics, resulting in PCB quality unqualified, or even scrapped. So what causes virtual welding? How do you find it in the production process?
The traditional way to judge the PCBA welding position is. According to the fault phenomenon, judge the approximate fault range, and use the appearance observation method, focusing on the observation of relatively large components and components with large heat. In addition, magnifying glass will be used to observe, but these methods are not able to achieve good detection effect.
X-ray detection technology has greatly broken through the traditional detection methods, and can easily cope with the increasingly miniaturized, miniaturized, high-density packaging of components.
Because of its excellent characteristics, X-ray detection technology is widely used in the production line in the electronics manufacturing industry, including the virtual welding detection of PCBA.
X-Ray detection can effectively control the welding and assembly quality of BGA, so to some extent, X-ray detection technology is a necessary means to ensure the quality of electronic assembly.
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