Dataifeng Best Reballing Chip Fixture for BGA Company - Dataifeng,All products use high-quality and high-precision imported raw materials (temperature control instrument, PLC, heater).
Reballing Chip Fixture for BGA.
Mold core, tin planting, reballing ball
Used for computer motherboard repair, various PCB production Chip production welding, etc
The three locating pins are closely matched with the top cover, and the chip and the fixing groove ensure the ball point and the position of the Steel Mesh Hole are precisely aligned.
The ball planter has a diversion groove design, which can easily pour out the excess solder balls
The user can customize the chip tray according to the chip size
The operation of fixing the chip in the chip fixing slot is simple and quick. The mold core is separated from the base, easy to replace
The four corners of the upper and lower frames are fixed with the steel mesh to keep the steel mesh flat. The three holes of the lower frame are matched with the pins of the base.
Product Name: BGA ball planting table
Product Material: Aluminum alloy
Applicable Steel Mesh: 80*80MM; 100*100MM; Customized according to chip size
Implantable Chip: Max 50MM; Max 70MM
Product Features: Lightweight and practical, accurate positioning, reflow design
Note: Suitable for large steel mesh, not suitable for heating small steel mesh
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The first thing we do is meeting with our clients and talk through their goals on a future project.
During this meeting, feel free to communicate your ideas and ask lots of questions.
They are all manufactured according to the strictest international standards. Our products have received favor from both domestic and foreign markets.
They are now widely exporting to 200 countries.