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PRODUCT DETAILS


               
Universal stencil kit fixture for CPU GPU BGA EMMC DDR chip

Mold core, tin planting, reballing ball

               
BGA bali plant ing effect is good

Used for computer motherboard repair, various PCB production Chip production welding, etc

               
Exactness

The three locating pins are closely matched with the top cover, and the chip and the fixing groove ensure the ball point and the position of the Steel Mesh Hole are precisely aligned.

               
Reflow design

The ball planter has a diversion groove design, which can easily pour out the excess solder balls


               
Chip card slot

The user can customize the chip tray according to the chip size

               
Easy to operate

The operation of fixing the chip in the chip fixing slot is simple and quick. The mold core is separated from the base, easy to replace

               
Solidity

The four corners of the upper and lower frames are fixed with the steel mesh to keep the steel mesh flat. The three holes of the lower frame are matched with the pins of the base.

               
Products real shot



Product Parameters

Product Name: BGA ball planting table

Product Material: Aluminum alloy

Applicable Steel Mesh: 80*80MM; 100*100MM; Customized according to chip size

Implantable Chip: Max 50MM; Max 70MM

Product Features: Lightweight and practical, accurate positioning, reflow design

Note: Suitable for large steel mesh, not suitable for heating small steel mesh

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