Intro to Solder Balls for BGA Dataifeng

Intro to Solder Balls for BGA Dataifeng

Dataifeng Intro to Solder Balls for BGA Dataifeng,Shenzhen Dataifeng Technology Co., Ltd. has more than ten years of research and development experience, has many senior technical engineers, and has applied for many national technology patents and professional inspection certificates in China

Solder Balls for BGA.

CONTACT US
SEND INQUIRY NOW
Phone: +86 13715211798
Telephone: +86 0755 36842859
Telephone: 18038121890
PRODUCT DETAILS


               
Smooth spherical surface without defects


               
BGA ball planting effect is good

Used for computer motherboard repair, various PCB production Chip production welding, etc.

               
BGA lead-free,leaded solder balls Various diameter specifications

High roundness/multiple specifications 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.76MM

               
Strong welding ability

Not only the beauty of the surface, we also care about the fine workmanship


               
Various diameter specifications

0.2MM-0.76MM are 250,000 capsules/bottle

               
Widely applicable

BGA solder balls replace the pins in the IC component packaging structure and can be applied to consumer electronic products such as notebooks, computer motherboards, mobile communication devices (hand-frequency communication devices), LEDs, LCDs, DCDs, and PDAs.

               
Products real shot




Add a comment
IF YOU HAVE MORE QUESTIONS,WRITE TO US
Just tell us your requirements, we can do more than you can imagine.