Welding Accessories
Professional Solution Provider for Various Industrial Applications.
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Professional Solution Provider for Various Industrial Applications.
Dataifeng Intro to Solder Balls for BGA Dataifeng,Shenzhen Dataifeng Technology Co., Ltd. has more than ten years of research and development experience, has many senior technical engineers, and has applied for many national technology patents and professional inspection certificates in China
Solder Balls for BGA.
Used for computer motherboard repair, various PCB production Chip production welding, etc.
High roundness/multiple specifications 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.76MM
Not only the beauty of the surface, we also care about the fine workmanship
0.2MM-0.76MM are 250,000 capsules/bottle
BGA solder balls replace the pins in the IC component packaging structure and can be applied to consumer electronic products such as notebooks, computer motherboards, mobile communication devices (hand-frequency communication devices), LEDs, LCDs, DCDs, and PDAs.
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GET IN TOUCH WITH US
The first thing we do is meeting with our clients and talk through their goals on a future project.
During this meeting, feel free to communicate your ideas and ask lots of questions.
They are all manufactured according to the strictest international standards. Our products have received favor from both domestic and foreign markets.
They are now widely exporting to 200 countries.
Founded in March 2009, Shenzhen Dataifeng Technology Co., Ltd.