PRODUCTS
VR
PRODUCT DETAILS


               
Smooth spherical surface without defects


               
BGA ball planting effect is good

Used for computer motherboard repair, various PCB production Chip production welding, etc.

               
BGA lead-free,leaded solder balls Various diameter specifications

High roundness/multiple specifications 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.76MM

               
Strong welding ability

Not only the beauty of the surface, we also care about the fine workmanship


               
Various diameter specifications

0.2MM-0.76MM are 250,000 capsules/bottle

               
Widely applicable

BGA solder balls replace the pins in the IC component packaging structure and can be applied to consumer electronic products such as notebooks, computer motherboards, mobile communication devices (hand-frequency communication devices), LEDs, LCDs, DCDs, and PDAs.

               
Products real shot




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contact US

GET IN TOUCH WITH US

The first thing we do is meeting with our clients and talk through their goals on a future project.
During this meeting, feel free to communicate your ideas and ask lots of questions.

Recommended

They are all manufactured according to the strictest international standards. Our products have received favor from both domestic and foreign markets.
They are now widely exporting to 200 countries.

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