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Introduction to the traditional BGA repair process

2022/12/20

At present, many electronic products will have a lot of BGA devices that need to be pasted on SMT patches, but it is inevitable that some BGA will not be pasted properly in the actual production process, and unlike capacitors and resistors with low unit price, the price of BGA is generally relatively high, so the BGA will be repaired. In fact, at this stage, many factories have changed to professional BGA repair equipment, such as Datafeng Optical BGA repair table repair success rate almost 100%, some friends without BGA repair table ask me, if there is no BGA repair table how to repair BGA chip, so what is the traditional BGA repair process?

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At present, many electronic products will have a lot of BGA devices that need to be pasted on SMT patches, but it is inevitable that some BGA will not be pasted properly in the actual production process, and unlike capacitors and resistors with low unit price, the price of BGA is generally relatively high, so the BGA will be repaired. In fact, at this stage, many factories have changed to professional BGA repair equipment, such as Datafeng Optical BGA repair table repair success rate almost 100%, some friends without BGA repair table ask me, if there is no BGA repair table how to repair BGA chip, so what is the traditional BGA repair process?

BGA removal

Clean and smooth the residual solder of PCB solder pad with soldering iron. Welding braid and flat shovel iron head can be used for cleaning. Pay attention not to damage the solder pad and solder resistance film during operation, and clean the flux residue with special cleaning agent.


dehumidification

Since PBGA is sensitive to moisture, it is necessary to check whether the device is damp before assembly, and dedamp the device.


Printing solder paste

Since other components have been installed on the surface assembly board, special BGA small template must be used. The thickness and opening size of the template should be determined according to the ball diameter and ball distance. After printing, the printing quality must be checked. For CSPS with ball spacing less than 0.4mm, solder paste can not be printed, so there is no need to process and repair the template, directly on the PCB solder pad brush paste flux. Put the PCB that needs to be removed into the welding furnace, press the reflow welding key, wait for the machine to finish according to the set program, press the enter and exit key when the temperature is the highest, use the vacuum pen to remove the components to be removed, and the PCB board can be cooled.


Cleaning pad

Clean and smooth the residual solder of PCB solder pad with soldering iron, which can be cleaned with dissoldering tape and flat shovel iron head. Pay attention not to damage the solder pad and solder resistance film during operation.


Printing solder paste

Since other components have been installed on the surface assembly board, special BGA small template must be used. The thickness and opening size of the template should be determined according to the ball diameter and ball distance. After printing, the printing quality must be checked. For CSPS with ball spacing less than 0.4mm, solder paste can not be printed, so there is no need to process and repair the template, directly on the PCB solder pad brush paste flux.


Attach the BGA

If it is a new BGA, it must be checked for moisture. If it is already damp, it should be demoistened before mounting. The removed BGA component can be reused in general, but it can only be used after ball planting.


Procedure for mounting BGA devices

A. Place the surface assembly plate printed with solder paste on the workbench

B. Select the appropriate suction nozzle and open the vacuum pump. The BGA device is sucked up, the bottom of the BGA device is completely coincident with the PCB pad, and the suction nozzle is moved down. The BGA device is affixed to the PCB, and then the vacuum pump is closed.


Reflow welding

The welding temperature can be set according to the size of the device, the thickness of PCB and other specific circumstances. The welding temperature of BGA is about 15 degrees higher than that of traditional SMDS.


The above is the introduction of the traditional BGA repair process. It can be seen that the whole process is relatively complicated. It is suggested that qualified friends directly use the BGA repair platform of Datafeng to repair in one step, which is convenient and practical.

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