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Can BGA repair anything? The function of bga repair table is introduced

2022/12/23

Can BGA repair anything? BGA is chip packaging technology, BGA chip repair equipment called BGA repair table whose repair range includes different package chips. BGA can improve the function of digital electronic products and reduce the volume of products through the structure of ball grid array. All digital electronic products through packaging technology will have a common characteristic, that is, small size, strong function, low cost, practical. BGA repair table is used to repair BGA chip equipment. When a chip is detected and needs to be repaired, it needs to use the BGA repair table to repair, which is the effect of the BGA repair table. Secondly, it is easy to operate. Choose BGA repair platform to repair BGA, can change the BGA repair hand in seconds. Simple upper and lower heating: heat through hot air, and use the air nozzle to control the hot air. The heat is concentrated on the BGA to prevent damage to the surrounding components.

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Can BGA repair anything? BGA is chip packaging technology, BGA chip repair equipment called BGA repair table whose repair range includes different package chips. BGA can improve the function of digital electronic products and reduce the volume of products through the structure of ball grid array. All digital electronic products through packaging technology will have a common characteristic, that is, small size, strong function, low cost, practical. BGA repair table is used to repair BGA chip equipment. When a chip is detected and needs to be repaired, it needs to use the BGA repair table to repair, which is the effect of the BGA repair table. Secondly, it is easy to operate. Choose BGA repair platform to repair BGA, can change the BGA repair hand in seconds. Simple upper and lower heating: heat through hot air, and use the air nozzle to control the hot air. The heat is concentrated on the BGA to prevent damage to the surrounding components.

BGA repair table is not easy to damage BGA chip and PCB board. We all understand that high temperature heating is required when repairing BGA, and the temperature control precision is very high at this time. A slight deviation may cause damage to BGA chip and PCB board. The temperature control precision of the BGA repair table can be accurate to 2 degrees, so that you can ensure that the chip is intact in the process of repairing the BGA chip, but also one of the roles of the hot air welding gun can not be compared. The core of the success of our BGA repair is the temperature and deformation of the board surrounding the repair, which are the key technical issues. Machines and equipment can prevent human influence factors to some extent, so that the success rate of repair can be improved and kept stable.

BGA repair table can also prevent solder from flowing to other pads, to achieve a symmetrical size of the welding ball. After washing the bga, it can be aligned and attached to the pcb, and then flow again. At this point, the component is repaired. It is important to note that the acceptance of manual washing pad is not able to remove impurities completely and completely in time. Therefore, it is recommended to choose automatic BGA repair table when selecting BGA repair table, which can save you most of the time, labor cost and money. Because the price is relatively high in ordering automatic BGA repair table, but the repair efficiency and function are incomparable to manual BGA repair table, so we should do a good job of evaluation and comparative analysis before ordering.

Above is a small series for you to introduce the effect of BGA repair table all content. BGA repair table can not repair anything, it is mainly applicable to (BGA, QFN, PGA, POP, PLCC, TQFP, TSOP...) And a variety of patch device repair. If you want to know more about the efficacy of BGA repair table or want to buy a high repair yield BGA repair table, you can learn about the full automatic BGA repair table of Datafeng Technology.

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