BGA preheating platform maintenance heating methods, at this stage in the market is more common heating methods are: 1, the upper and lower two temperature areas of hot air circulation temperature control BGA preheating platform; 2. All the upper and lower parts are heated in the form of dark red external heating; 3, the upper hot air circulation, the lower dark red external heating assistance; 4, the upper and lower hot air microcirculation heating, the middle with a large area of dark red outside three temperature zone heating. Next, Xiaobian will introduce the advantages and disadvantages of these 4 heating methods.
1. The upper and lower temperature zones are all heated by BGA preheating station with hot-air microcirculation temperature control. The advantage of this method is that the temperature is rising fast and the temperature is falling fast. The main disadvantage is that the temperature difference between the surface and the inside is relatively large, the permeability is weak, and the temperature sustainability is relatively poor.
2, the upper and lower dark red external heating mode, the advantage of this method is that it can be heated continuously, in view of the relatively slow heating characteristics of dark red external heating mode of permeability performance is better. High success rate of BGA chip maintenance. The main disadvantage is that in view of the use of dark red external heating method, there are requirements for the color of PCBA substrate, can not be maintained white PCBA board because it will reflect the light and lead to uneven heat absorption of the board resulting in bending damage, and another main disadvantage is that the heating is too slow, low maintenance efficiency.
3, the upper hot air lower dark red outside heating mode, such a heating mode is equivalent to the hot air heating speed and dark red outside continuous temperature advantages set together, after the use of dark red outside preheating to a certain temperature, the use of hot air temperature acceleration maintenance efficiency. The main disadvantage is that such a heating way of BGA preheating station can only repair the simple structure of the BGA chip, if the maintenance structure of the complex point of the chip can not be well controlled at the bottom of the temperature warming and cooling problems.
4, the upper and lower hot air microcirculation heating, the middle with a large area of dark red outside three temperature zone heating method, this method is more humane than the previous three heating methods, and brings together all the advantages of the previous several methods, can accelerate the temperature rise and fall speed, can continue to supply temperature, maintenance yield and efficiency than the previous three heating methods increased by 95%, The only major disadvantage is that the price is a little more expensive than the previous 3 kinds of heating preheating platform, usually the price is positioned between 100,000 yuan ~ 2 million yuan.
About the BGA preheating platform maintenance heating way to explain here, presumably we can master the BGA preheating platform maintenance heating way through the above information, if you are now in the purchase of BGA preheating platform that you can understand the Da Tai Feng technology automatic preheating platform, for EMS factory, quality assurance, good user reputation. You may also be interested in the BGA repair table.
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