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Application of X-RAY detector in IC chip detection

2022/12/28

IC chips are composed of a large number of microelectronic components, so they are also called integrated circuits. It's a small chip, but with so many electronic components, it's difficult to test. x-ray inspection is widely used in various industries. What is its application on IC chips? What are the differences with traditional detection methods? Let's take a look.

Chip increasingly pursue miniaturization, low power design, circuit more and more accurate, more and more difficult to detect. The traditional method of chip stripping is to strip the chip layer by layer and then to detect the surface defect of the chip through the microscope. This method is not only imperfect in checking for defects, but also damages the chip.


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IC chips are composed of a large number of microelectronic components, so they are also called integrated circuits. It's a small chip, but with so many electronic components, it's difficult to test. x-ray inspection is widely used in various industries. What is its application on IC chips? What are the differences with traditional detection methods? Let's take a look.

Chip increasingly pursue miniaturization, low power design, circuit more and more accurate, more and more difficult to detect. The traditional method of chip stripping is to strip the chip layer by layer and then to detect the surface defect of the chip through the microscope. This method is not only imperfect in checking for defects, but also damages the chip.

X-RAY testing, on the other hand, uses X-RAY penetration technology to penetrate the chip so that any defects inside a small chip can be seen without any damage. After the discovery of X-RAY nondestructive testing, everyone will throw away the traditional stripping chip testing method, in addition to chip nondestructive testing, X-RAY can also nondestructive testing LED beads, semiconductor and other commodity defects.

x-ray nondestructive testing technology is a new detection technology. On the basis of ensuring that the chip itself is not damaged, X-ray penetration is used to detect the chip and the detected defect information is projected into the imaging system, so that engineers can intuitively see the internal defect of the chip, including the location and size of the defect.

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