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How to judge the quality of BGA repair table

2023/01/03

BGA repair table, that is, BGA welding table, because many people do not know much about the BGA repair industry, how to judge the quality of the BGA repair table, has become a hot topic for new customers to consult. Let me tell you in detail from what aspects to decide?


The quality of BGA repair platform depends on the quality of hardware configuration equipment. Therefore, the first thing to know is the important components of BGA repair platform -- BGA repair platform host, temperature control system, alignment system, automatic dismantling system, intelligent safety protection system, three-part heating system, flexible and easy to use PCBA placement platform, etc. Then there are the detailed criteria:


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BGA repair table, that is, BGA welding table, because many people do not know much about the BGA repair industry, how to judge the quality of the BGA repair table, has become a hot topic for new customers to consult. Let me tell you in detail from what aspects to decide?


The quality of BGA repair platform depends on the quality of hardware configuration equipment. Therefore, the first thing to know is the important components of BGA repair platform -- BGA repair platform host, temperature control system, alignment system, automatic dismantling system, intelligent safety protection system, three-part heating system, flexible and easy to use PCBA placement platform, etc. Then there are the detailed criteria:

1. As we all know, whether the working temperature is accurate control is directly related to the repair pass rate of BGA chip. Now there are three temperature area BGA repair table and two temperature area BGA repair table on the market, and the three temperature area equipment is more accurate than the two temperature area equipment temperature control, and the repair pass rate is higher, so it is recommended to select the three temperature area BGA repair table in the selection process;


2. The alignment system, whether the alignment can be accurate, whether the corresponding positions can be colocated according to different PCBA substrate colors;


3. Whether the machine and equipment of the automatic dismantling system can automatically carry out different processes of dismantling and welding. In the process of dismantling components, the machine and equipment will automatically pick up the components and separate them from PCB after the completion of heating. In the process of pasting components, after the alignment is completed, the machine and equipment will automatically implement the whole process of pasting, heating and cooling to avoid manual pasting shift, and the repair rate can reach 100%;


4 intelligent safety protection system is also very important, need to check the safety protection system sensitivity and accuracy;


5. Attention should be paid to the temperature rise of the three heating systems, which should reach the temperature specified in the qualified book;

6. Flexible and easy to use PCBA substrate placement platform, which can be moved forward and left and right flexibly, combined with the Angle adjustment of components and the flexible movement of area heaters, so that any size and shape of PCBA can be easily placed;


If customers can choose BGA repair products in accordance with the above standard provisions to choose the case, it is not a difficult thing to select high quality equipment, you can go to Datafeng technology.

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