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A few tips to find the BGA repair table!

2023/01/05

At present, there are a lot of products using BGA packaging in the market, from notebook, mobile phone, webcam, computer motherboard and other products basically use BGA packaging technology, at the same time, the technical difficulty of BGA maintenance is not low, so it is very important to choose a good BGA repair table. Today, Datafeng Technology will give you a general explanation of some problems that need to be paid attention to about BGA repair table.

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At present, there are a lot of products using BGA packaging in the market, from notebook, mobile phone, webcam, computer motherboard and other products basically use BGA packaging technology, at the same time, the technical difficulty of BGA maintenance is not low, so it is very important to choose a good BGA repair table. Today, Datafeng Technology will give you a general explanation of some problems that need to be paid attention to about BGA repair table.

First, basic questions

1. Maintain the PCB size of the product

Generally, the customers who buy BGA repair table are mostly used to repair laptop computers or desktop computers, so at this time, there is no need for large size workbench BGA repair table. The BGA repair table of Datafeng Technology is sufficient to meet the computer BGA repair in the market. The specific situation should be decided according to the actual maintenance situation of individuals, so the size of PCB splint needs to be paid attention to.

2. Chip size problem

Generally, there is no need to worry about this problem, because normally the supplier will provide corresponding air nozzle, and the relevant size can be customized.

Two, functional problems

1, three temperature zone

The three temperature area mainly refers to the upper part of the machine, the lower part and the bottom of the heating area. At present, Datafeng technology uses three temperature areas controlled by independent programming: upper temperature area and lower temperature area convection hot air heating, the lower temperature area uses a large area of heating wire layout.

2, temperature curve temperature control

The repair of the BGA is not something that can be done by melting the tin and removing the chip. A high-quality repair requires the use of temperature curves to repair, through temperature regulation, control, reduce the heating process of the chip itself damage. Moreover, temperature curve control through software Settings can ensure the accuracy of temperature, and can realize the observation of temperature itself changes.

The most important thing is probably the above points. Of course, after-sales service and brand are also very important, which is a kind of guarantee for the product itself. Shenzhen Da Tai Feng Technology Co., Ltd. is a research and development, production, sales as one of the SMT solutions provider, Shenzhen famous brand.

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