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Discussion on technical innovation of BGA repair station

2023/01/07

Abstract: With the rapid development of modern electronic technology and the continuous expansion of the functions of electronic machine products, SMT repair equipment to high precision, intelligent, multifunctional, reliability, repeatability and economic direction of continuous development. As a professional manufacturer of BGA repair station for SMT industry repair equipment, Datafeng Technology has received close attention from the industry and solved the repair problem of small chip size and many pins. This paper mainly introduces the new ideas and technical characteristics of BGA repair station development, and systematically introduces the chip package repair solution.

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Abstract: With the rapid development of modern electronic technology and the continuous expansion of the functions of electronic machine products, SMT repair equipment to high precision, intelligent, multifunctional, reliability, repeatability and economic direction of continuous development. As a professional manufacturer of BGA repair station for SMT industry repair equipment, Datafeng Technology has received close attention from the industry and solved the repair problem of small chip size and many pins. This paper mainly introduces the new ideas and technical characteristics of BGA repair station development, and systematically introduces the chip package repair solution.

1. Technical development trend of BGA repair station

In order to meet the requirements of smaller volume, lighter weight and lower cost of electronic complete products, electronic product manufacturers are increasingly using precision assembly of micro components; However, in the actual assembly process, even the implementation of better assembly technology can not completely avoid the generation of defective products. For high-precision and highly integrated electronics manufacturing industry, repair and rework is a necessary process. Obviously, repair equipment (BGA repair station) is not only an indispensable part of the manufacturing service range, but also has become an investment that can bring considerable returns.

At present, the BGA repair stations on the market include: A. According to the types, they can be divided into two kinds: hot air heating and infrared heating; B, according to the type of machine, it is divided into two kinds: two temperature zone and three temperature zone (two temperature zone, generally using the upper hot air, the lower infrared; Three temperature area is generally used, upper, lower hot air, infrared at the bottom (to solve PCB deformation); C, according to the technical level: manual, semi-automatic and automatic three types (Datafeng is a Chinese independent research and development and production of automatic BGA repair station enterprises).

Although the traditional manual repair and manual repair stands still occupy the mainstream of the market, their market share is gradually being replaced by semi-automatic and fully automatic repair stands. This is mainly because the repair speed and accuracy of semi-automatic and automatic repair table is higher than that of low-end manual, and the labor intensity is reduced.

With the increase in the number of advanced packaging pins, the equipment requiring repair also experiences great technological changes for the defects such as bridge connection, missed welding and virtual welding that appear in the assembly process of fine pins. With the continuous change of manufacturing process and component packaging technology, the electronic assembly market demand for safe, reliable, reusable and portable repair equipment is constantly increasing. When carrying out the repair work, how to ensure the success of the whole process, without causing any damage or avoiding unnecessary thermal stress during the repair work is very important.

Therefore, the repair technology must have sufficient placement capacity to ensure that the PCB board does not deform during heating, and excellent heating control capability to save the preparation time during heating and provide a better heating curve. The BGA repair station has good repeatability and precision.

2. New design concept of BGA repair station

As we know, the improvement of the production process of BGA repair station needs to go through long-term exploration, experiment and test. The real-time dynamic and sustainable improvement quality management system (ISO9001:2008) compatible with the production is the latest scientific research achievement in the SMT repair equipment industry.

At present, there are still some problems in accuracy and slow operation speed in manual and optical alignment. Thus, guiding process improvement, improving production efficiency and reducing cost become the key means to ensure high quality. In view of this key control link, Datafun company is promoted to propose a new alignment system solution, which meets the precision, repeatability and high-speed operation characteristics of SMT repair equipment industry at the same time. Through the design of reasonable precision mechanical mechanism, optical system, visual system and software system, automatic positioning, diswelding, mounting and welding function technologies are realized.

3. Technical characteristics and key points of BGA repair station

No matter the high or low end repair BGA repair table, there is a common key control technology characteristic for heating mode; A: The heating principle of infrared: slow temperature rise in the early stage, fast temperature rise in the late stage, relatively strong penetration. B: Hot air heating theory: Hot air heats up quickly and cools down quickly. The temperature is easily and stably controlled. Through the principle analysis, infrared heating and hot air heating is a better choice. The upper and lower parts use hot air heating stability, good control of temperature rise and fall; At the bottom, infrared preheating is used to prevent PCB deformation (the deformation reason is generally caused by the large temperature difference between the BGA position and the PCB position. The bottom preheating gives certain heat to the PCB, so that the PCB is less temperature than the BGA, but does not melt).

Another key control point is alignment. During the repair process, whether the PCB pad is accurately aligned with the BGA pin or tin ball is a critical control point before the welding action. Advanced automatic visual recognition system positioning, different models and different types of BGA core through the image processing software automatic detection, analysis and memory, the combination of the two forms a high-precision, powerful, stable performance, simple operation of the alignment mechanism. In order to prevent the appearance of dislocation and deviation in the process of placing PCB board during manual operation, this phenomenon is the key point of vision system and software system, but also causes some technical difficulties in the design: A: clear image processing technology; B: System stability; C: Detect the accuracy of automatic memory analysis.


4. Technical solutions for BGA repair

Da Tai Feng Technology Co., Ltd. is a high-tech enterprise integrating R&D, production and sales. In the SMT repair equipment industry, we have created our own national brand, got rid of the blockade of foreign technology, achieved the optimization of product performance and zero breakthrough, filled the gap in this field in China, and has independent patents and intellectual property rights.

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Check out my email address: dtf2009@dataifeng.cn

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