Specific scope of application .
(1) IC: Support SOP, TSOP, TSSOP, QFN a
and o
other packages, the smallest
pitch (Pitch) 0. 3mm; Support BGA, CSP package, the smallest ball diameter
(Ball) 0. 25mm; Maximum ball diameter 0. 55mm
(2) Various PCBA motherboards, requiring precision circuit tin on the
motherboard,small
motherboard,minimum size 2*2MM,maximum sui table for
220*110 printing objects
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