BGA and PGA are a kind of chip packaging. The pins are at the bottom of the chip, so you can't see the pins when you weld them up. Moreover, the prices are very high. BGA and PGA look similar in appearance, but there are big differences between them.
The difference between BGA and PGA can be carefully identified in the following aspects.
Introduction to BGA packaging
The memory encapsulated by BGA technology can increase the memory capacity by two to three times without changing the memory volume. Compared with TSOP, BGA has smaller volume, better heat dissipation performance and electrical performance. BGA packaging technology has greatly improved the storage per square inch, using BGA packaging technology memory products at the same capacity, only one third of the volume of TSOP packaging; In addition, compared with traditional TSOP packaging, BGA packaging has a faster and more effective way to dissipate heat.
The I/O terminals of BGA package are distributed under the package in the form of array with circular or cylindrical solder joints. The advantage of BGA technology is that although the number of I/O pins increases, the spacing of pins increases instead of decreasing, thus improving the assembly yield. Although its power consumption increases, BGA can be welded by controlled collapse chip method, which can improve its electric heating performance. Thickness and weight are reduced compared to previous packaging techniques; The parasitic parameter (current changes greatly, causing the output voltage disturbance) is reduced, the signal transmission delay is small, the use of frequency is greatly improved; Assembly can be coplanar welding, high reliability.
Introduction to PGA packaging
PGA Package, English full name (Pin Grid Array Package), Chinese meaning called pin grid array package technology, by this technology package chip inside and outside a plurality of square array pins, each square array pins along the chip around a certain distance, according to the number of pins, can be enclosed into 2 ~ 5 circles. To install, plug the chip into a special PGA socket.
First, from the shape of the pin
BGA pin is ball, generally directly welded on the PCB board, welding requires a special BGA repair platform, individual can not dissolder; The PGA pin is pin-shaped. When installing, the PGA can be inserted into a special PGA socket for easy disassembly.
Second, in terms of cost
BGA is developed on the basis of PGA, BGA technology is more advanced, welding is simpler than PGA, the price is cheaper than PGA; PGA is an older package that is more cumbersome to solder and more expensive. BGA's cost performance ratio is much higher than PGA's.
Three, from the application
BGA is a chip designed to adapt to small and thin electronic products. The chip is more integrated and more powerful. It is generally used in thin notebook motherboards (such as X series notebooks). The PGA is an older chip, larger than the BGA, and is typically used in desktop computers (the usual T-series, replaceable CPU).
Both BGA and PGA are surface mount components. Nowadays, PGA has been used less, while BGA is more popular and widely used.
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